ASAP Semiconductor is a premier purchasing platform for 486839001 Heat Sink : Thermal Heat Sink Module - For Discrete Model Notebook components and other products that meet the highest industry standards possible. More than that, we have market experts on standby to answer any inquiries, in addition to responding to RFQ submissions in as little as 15 minutes or less. Furthermore, we make it a priority to meet our customers’ operational requirements with time and cost savings made possible through our purchasing power and global supply-chain network. As such, submit the RFQ form on this page to receive a competitive quote for part number 486839-001 by Hp, and see why customers continuously depend on our market expertise time and time again. If you require one-on-one assistance, send us an email or give us a call; our experts are happy to walk you through the purchasing process for part number 486839-001.