| Part Number : ATS-PCB1073 | Manufacturer : Advanced Thermal Solutions | |
| Description : to-263 package 12.7 x 26.2 x 10.2 mm 9.5? c/w board level stamped heat sink | ||
| Main Category : thermal management devices | ||
| Category : heatsinks | ||
| Alternate P/N: ATSPCB1073 | ||
When your operations require quality To-263 Package 12.7 X 26.2 X 10.2 Mm 9.5? C/W Board Level Stamped Heat Sink electromechanical parts from leading entities that operate with quality at the forefront of their business endeavors, connect with the experts at ASAP Semiconductor. On this page, you can submit a quote request for part number ATS-PCB1073 by Advanced Thermal Solutions and/or any other component within our ready-to-purchase catalogs.
At ASAP Semiconductor, we value our customers, so we make it our priority to meet their varying operational parameters with high-quality Heatsinks electromechanicals. That being said, we are more than happy to formulate a competitive solution for part number ATS-PCB1073 by Advanced Thermal Solutions. We only ask that you fill out the form below with as much information as you can regarding your needs so that we can secure part number ATS-PCB1073 with time and cost savings. If you prefer one-on-one assistance from one of our representatives, contact us via phone or email at any time; we are available around the clock!
| Attachment Method | - |
| Dimension | H? 10.2mm?x?L? 12.7mm?x?W? 26.2mm |
| Material Finish | Tin |
| Category | Fans, Thermal Management, Thermal, Heat Sinks |
| Thermal Resistance @ Forced Air Flow | 9.50?C/W @ 200 LFM |
| Material | Copper |
| Diameter | - |
| Fin Height | 0.402 (10.21mm) |
| Shape | Rectangular |
| Package Cooled | TO-263 (D?Pak) |
| Mfr | Advanced Thermal Solutions Inc. |
| Thermal Resistance @ Natural | 18.00°C/W |
| Thermal Resistance | 9.5?C/W |
| Product Status | Active |
| Base Product Number | ATS-PCB |
| Shape | Rectangular, Fins |
| Power Dissipation @ Temperature Rise | - |
| Type | Top Mount |
| Part Number : ATS-PCB1073 | Manufacturer : Advanced Thermal Solutions | |
| Description : to-263 package 12.7 x 26.2 x 10.2 mm 9.5? c/w board level stamped heat sink | ||
| Main Category : thermal management devices | ||
| Category : heatsinks | ||
When your operations require quality To-263 Package 12.7 X 26.2 X 10.2 Mm 9.5? C/W Board Level Stamped Heat Sink electromechanical parts from leading entities that operate with quality at the forefront of their business endeavors, connect with the experts at ASAP Semiconductor. On this page, you can submit a quote request for part number ATS-PCB1073 by Advanced Thermal Solutions and/or any other component within our ready-to-purchase catalogs.
At ASAP Semiconductor, we value our customers, so we make it our priority to meet their varying operational parameters with high-quality Heatsinks electromechanicals. That being said, we are more than happy to formulate a competitive solution for part number ATS-PCB1073 by Advanced Thermal Solutions. We only ask that you fill out the form below with as much information as you can regarding your needs so that we can secure part number ATS-PCB1073 with time and cost savings. If you prefer one-on-one assistance from one of our representatives, contact us via phone or email at any time; we are available around the clock!
We hope that you will visit us again the next time you need board-level components, aviation and aerospace parts, and more. Allow us to serve as your strategic purchasing partner.
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