| Part Number : 374024B00035G | Manufacturer : Boyd | |
| Description : bga 23 x 23 x 10 mm 40 ?c/w tape attachment metal heat sink | ||
| Main Category : thermal management devices | ||
| Category : heatsinks | ||
When your operations require quality Bga 23 X 23 X 10 Mm 40 ?C/W Tape Attachment Metal Heat Sink electromechanical parts from leading entities that operate with quality at the forefront of their business endeavors, connect with the experts at ASAP Semiconductor. On this page, you can submit a quote request for part number 374024B00035G by Boyd and/or any other component within our ready-to-purchase catalogs.
At ASAP Semiconductor, we value our customers, so we make it our priority to meet their varying operational parameters with high-quality Heatsinks electromechanicals. That being said, we are more than happy to formulate a competitive solution for part number 374024B00035G by Boyd. We only ask that you fill out the form below with as much information as you can regarding your needs so that we can secure part number 374024B00035G with time and cost savings. If you prefer one-on-one assistance from one of our representatives, contact us via phone or email at any time; we are available around the clock!
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Base Product Number | 374024 |
| Category | Fans, Thermal Management, Thermal, Heat Sinks |
| Diameter | - |
| Dimension | H? 10mm?x?L? 23mm?x?W? 23mm |
| Fin Height | 0.394 (10.00mm) |
| Fin Style | Channel Cut Fin |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Material Finish | Black Anodized |
| Mfr | Aavid, Thermal Division of Boyd Corporation |
| Mounting Method | Top Mount |
| Package Cooled | BGA |
| Power Dissipation @ Temperature Rise | 1.0W @ 40?C |
| Product Status | Active |
| Shape | Square |
| Shape | Square, Pin Fins |
| Shelf Life | - |
| Thermal Resistance | 11.7?C/W |
| Thermal Resistance @ Forced Air Flow | 11.70?C/W @ 200 LFM |
| Thermal Resistance @ Natural | 40.00°C/W |
| Type | Top Mount |
| Part Number : 374024B00035G | Manufacturer : Boyd | |
| Description : bga 23 x 23 x 10 mm 40 ?c/w tape attachment metal heat sink | ||
| Main Category : thermal management devices | ||
| Category : heatsinks | ||
When your operations require quality Bga 23 X 23 X 10 Mm 40 ?C/W Tape Attachment Metal Heat Sink electromechanical parts from leading entities that operate with quality at the forefront of their business endeavors, connect with the experts at ASAP Semiconductor. On this page, you can submit a quote request for part number 374024B00035G by Boyd and/or any other component within our ready-to-purchase catalogs.
At ASAP Semiconductor, we value our customers, so we make it our priority to meet their varying operational parameters with high-quality Heatsinks electromechanicals. That being said, we are more than happy to formulate a competitive solution for part number 374024B00035G by Boyd. We only ask that you fill out the form below with as much information as you can regarding your needs so that we can secure part number 374024B00035G with time and cost savings. If you prefer one-on-one assistance from one of our representatives, contact us via phone or email at any time; we are available around the clock!
We hope that you will visit us again the next time you need board-level components, aviation and aerospace parts, and more. Allow us to serve as your strategic purchasing partner.
Request for Quote
