| Part Number : 2292BG | Manufacturer : Boyd (Formerly Aavid) | |
| Description : boyd 2292bg - 28.58mm length, 28.58mm width - bond-on heat sink for leadless chip carriers and flat packs. primarily designed for 68-position devices. | ||
| Main Category : thermal management | ||
| Category : heat sinks | ||
| Sub Category : fpga and bga heat sinks | ||
When your operations require quality Boyd 2292Bg - 28.58Mm Length, 28.58Mm Width - Bond-On Heat Sink For Leadless Chip Carriers And Flat Packs. Primarily Designed For 68-Position Devices. electromechanical parts from leading entities that operate with quality at the forefront of their business endeavors, connect with the experts at ASAP Semiconductor. On this page, you can submit a quote request for part number 2292BG by Boyd (Formerly Aavid) and/or any other component within our ready-to-purchase catalogs.
At ASAP Semiconductor, we value our customers, so we make it our priority to meet their varying operational parameters with high-quality Heat Sinks electromechanicals. That being said, we are more than happy to formulate a competitive solution for part number 2292BG by Boyd (Formerly Aavid). We only ask that you fill out the form below with as much information as you can regarding your needs so that we can secure part number 2292BG with time and cost savings. If you prefer one-on-one assistance from one of our representatives, contact us via phone or email at any time; we are available around the clock!
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Category | Fans, Thermal Management, Thermal, Heat Sinks |
| Diameter | 0.300 (7.62mm) ID, 1.125 (28.57mm) OD |
| Fin Height | - |
| Material Finish | Black Anodized |
| Mfr | Aavid, Thermal Division of Boyd Corporation |
| Package Cooled | BGA |
| Power Dissipation @ Temperature Rise | 1.5W @ 40?C |
| Product Status | Active |
| Shape | Cylindrical |
| Thermal Resistance @ Forced Air Flow | 8.00?C/W @ 400 LFM |
| Thermal Resistance @ Natural | - |
| Type | Board Level |
| Part Number : 2292BG | Manufacturer : Boyd (Formerly Aavid) | |
| Description : boyd 2292bg - 28.58mm length, 28.58mm width - bond-on heat sink for leadless chip carriers and flat packs. primarily designed for 68-position devices. | ||
| Main Category : thermal management | ||
| Category : heat sinks | ||
| Sub Category : fpga and bga heat sinks | ||
When your operations require quality Boyd 2292Bg - 28.58Mm Length, 28.58Mm Width - Bond-On Heat Sink For Leadless Chip Carriers And Flat Packs. Primarily Designed For 68-Position Devices. electromechanical parts from leading entities that operate with quality at the forefront of their business endeavors, connect with the experts at ASAP Semiconductor. On this page, you can submit a quote request for part number 2292BG by Boyd (Formerly Aavid) and/or any other component within our ready-to-purchase catalogs.
At ASAP Semiconductor, we value our customers, so we make it our priority to meet their varying operational parameters with high-quality Heat Sinks electromechanicals. That being said, we are more than happy to formulate a competitive solution for part number 2292BG by Boyd (Formerly Aavid). We only ask that you fill out the form below with as much information as you can regarding your needs so that we can secure part number 2292BG with time and cost savings. If you prefer one-on-one assistance from one of our representatives, contact us via phone or email at any time; we are available around the clock!
We hope that you will visit us again the next time you need board-level components, aviation and aerospace parts, and more. Allow us to serve as your strategic purchasing partner.
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