| Part Number : 335814B00000G | Manufacturer : Boyd (Formerly Aavid) | |
| Description : boyd 335814b00000g - 9.4mm height, 30.1mm length, 30.1mm width - bi-directional heat sink with epoxy attachment | ||
| Main Category : thermal management | ||
| Category : heat sinks | ||
| Sub Category : fpga and bga heat sinks | ||
When your operations require quality Boyd 335814B00000g - 9.4Mm Height, 30.1Mm Length, 30.1Mm Width - Bi-Directional Heat Sink With Epoxy Attachment electromechanical parts from leading entities that operate with quality at the forefront of their business endeavors, connect with the experts at ASAP Semiconductor. On this page, you can submit a quote request for part number 335814B00000G by Boyd (Formerly Aavid) and/or any other component within our ready-to-purchase catalogs.
At ASAP Semiconductor, we value our customers, so we make it our priority to meet their varying operational parameters with high-quality Heat Sinks electromechanicals. That being said, we are more than happy to formulate a competitive solution for part number 335814B00000G by Boyd (Formerly Aavid). We only ask that you fill out the form below with as much information as you can regarding your needs so that we can secure part number 335814B00000G with time and cost savings. If you prefer one-on-one assistance from one of our representatives, contact us via phone or email at any time; we are available around the clock!
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Base Product Number | 335814 |
| Category | Fans, Thermal Management, Thermal, Heat Sinks |
| Diameter | - |
| Fin Height | 0.354 (9.00mm) |
| Material Finish | Black Anodized |
| Mfr | Aavid, Thermal Division of Boyd Corporation |
| Package Cooled | BGA |
| Power Dissipation @ Temperature Rise | - |
| Product Status | Active |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow | 5.61?C/W @ 200 LFM |
| Thermal Resistance @ Natural | 10.50°C/W |
| Type | Top Mount |
| Part Number : 335814B00000G | Manufacturer : Boyd (Formerly Aavid) | |
| Description : boyd 335814b00000g - 9.4mm height, 30.1mm length, 30.1mm width - bi-directional heat sink with epoxy attachment | ||
| Main Category : thermal management | ||
| Category : heat sinks | ||
| Sub Category : fpga and bga heat sinks | ||
When your operations require quality Boyd 335814B00000g - 9.4Mm Height, 30.1Mm Length, 30.1Mm Width - Bi-Directional Heat Sink With Epoxy Attachment electromechanical parts from leading entities that operate with quality at the forefront of their business endeavors, connect with the experts at ASAP Semiconductor. On this page, you can submit a quote request for part number 335814B00000G by Boyd (Formerly Aavid) and/or any other component within our ready-to-purchase catalogs.
At ASAP Semiconductor, we value our customers, so we make it our priority to meet their varying operational parameters with high-quality Heat Sinks electromechanicals. That being said, we are more than happy to formulate a competitive solution for part number 335814B00000G by Boyd (Formerly Aavid). We only ask that you fill out the form below with as much information as you can regarding your needs so that we can secure part number 335814B00000G with time and cost savings. If you prefer one-on-one assistance from one of our representatives, contact us via phone or email at any time; we are available around the clock!
We hope that you will visit us again the next time you need board-level components, aviation and aerospace parts, and more. Allow us to serve as your strategic purchasing partner.
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