| Part Number : 2-64X3-16B1N-SL-ST-ZC | Manufacturer : Other | |
| Description : boyd 342100f00000g - 101.6mm length, 38.1mm width - low profile copper heat sink for pci and agp chip sets when space is at a premium, boyd???s thin-fin heat sinks reduce package case temperature by as much as 20??c. these flexible, copper spreaders attach to the electronic package using pre-applied adhesive, providing an off-theshelf solution for pci and agp chip sets. a laminated dielectric coating prevents shorting,making the thin-fin ideal for bga devices and multimedia applications. | ||
| Main Category : fasteners | ||
| Category : screws and bolts | ||
| Sub Category : machine screws and bolts | ||
| Alternate P/N: 264X316B1NSLSTZC | ||
ASAP Semiconductor is a one-stop shop for top-quality Fasteners and Screws And Bolts parts you can trust, our commitment to quality, competitive pricing, and rapid lead times ensuring that you can secure all that you need with ease. You have taken a particular interest in part number 2-64X3-16B1N-SL-ST-ZC, a Boyd 342100F00000g - 101.6Mm Length, 38.1Mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications. item that is currently available for purchase on our website at any time. If you are interested in learning more about this particular listing, be sure to fill out and submit the form provided below on this page with as much information as you can regarding your unique needs and restrictions. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : 2-64X3-16B1N-SL-ST-ZC | Manufacturer : Other | |
| Description : boyd 342100f00000g - 101.6mm length, 38.1mm width - low profile copper heat sink for pci and agp chip sets when space is at a premium, boyd???s thin-fin heat sinks reduce package case temperature by as much as 20??c. these flexible, copper spreaders attach to the electronic package using pre-applied adhesive, providing an off-theshelf solution for pci and agp chip sets. a laminated dielectric coating prevents shorting,making the thin-fin ideal for bga devices and multimedia applications. | ||
| Main Category : fasteners | ||
| Category : screws and bolts | ||
| Sub Category : machine screws and bolts | ||
ASAP Semiconductor is a one-stop shop for top-quality Fasteners and Screws And Bolts parts you can trust, our commitment to quality, competitive pricing, and rapid lead times ensuring that you can secure all that you need with ease. You have taken a particular interest in part number 2-64X3-16B1N-SL-ST-ZC, a Boyd 342100F00000g - 101.6Mm Length, 38.1Mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications. item that is currently available for purchase on our website at any time. If you are interested in learning more about this particular listing, be sure to fill out and submit the form provided below on this page with as much information as you can regarding your unique needs and restrictions. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
To ensure Fasteners and Screws And Bolts parts we offer are the best on the market, we go above and beyond industry expectations with rigorous quality assurance practices carried out throughout each step of sourcing and fulfillment. For example, part number 2-64X3-16B1N-SL-ST-ZC and other Boyd 342100f00000g - 101.6mm Length, 38.1mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications. products trace back to leading manufacturers like Other that we have carefully vetted, and countless listings undergo varying levels of testing and inspection prior to shipment. Coupled with other practices and dedications, we operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. With this in mind, kick off procurement for part number 2-64X3-16B1N-SL-ST-ZC today and see why so many rely on ASAP Semiconductor for their operational needs.
We hope that you will visit us again the next time you need board-level components, aviation and aerospace parts, and more. Allow us to serve as your strategic purchasing partner.
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