ASAP Semiconductor is an industry-leading distributor for shopping for parts by National Stock Number (NSN) data, the items featured within this catalog all falling under NSN 5962-01-233-2299 (5962012332299). Toward the top of this page, you will find several details that pertain to this NSN, allowing you to confirm various aspects of these offerings to ensure accurate procurement. Meanwhile, the part numbers that we have available for purchase can be found below, with Request for Quote (RFQ) links provided alongside each should you wish to make a purchase. Our team is also available by phone or email to support you during the procurement process, so never hesitate to take the first step with us.
Alternative NSN: | 5962012332299 |
Manufacturers | Ge Aviation Systems Ltd , Intel Corporation , Xicor Inc |
Item Name | Microcircuit Memory |
INC Code | 41015 |
Federal Supply Group (FSG) | 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-233-2299 (012332299) |
NCB Code | USA (01) |
Part No | Manufacturer | Item Name | CAGE Code | Type | Status | Availability | RFQ | |
---|---|---|---|---|---|---|---|---|
160674-03 | ge aviation systems ltd | microcircuit memory | 35351 | a | a | Avl | RFQ |
|
MR2864A B 35 | intel corporation | microcircuit memory | 34649 | a | a | Avl | RFQ |
|
X2864AC6148 | xicor inc | microcircuit memory | 60395 | a | a | Avl | RFQ |
|
X2864AEMB 35 C6148 | xicor inc | microcircuit memory | 60395 | a | a | Avl | RFQ |
|
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.105 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 770.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND PROGRAMMABLE AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 24 INPUT |
CRHL | BIT QUANTITY | 65536 |
CSWJ | WORD QUANTITY | 8192 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.0 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
5945-01-417-4215 (5945014174215) | 5935-01-075-6787 (5935010756787) | 5905-00-944-9222 (5905009449222) | 5998-01-244-8813 (5998012448813) |
5915-00-907-5624 (5915009075624) | 5950-00-965-9761 (5950009659761) | 5905-00-799-8794 (5905007998794) | 5910-00-405-8227 (5910004058227) |
5998-01-109-7002 (5998011097002) | 5940-01-284-2691 (5940012842691) | 5920-01-502-5817 (5920015025817) | 5905-00-969-6448 (5905009696448) |
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