Part Number : AM27S181A BJA | Manufacturer : Advanced Micro Devices Inc | ||
NSN : 5962-01-248-8649 (5962012488649) | |||
Item Name : Microcircuit Memory | CAGE Code : 34335 | ||
NIIN : 01-248-8649 (012488649) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA |
Thank you for taking an interest in part number AM27S181A BJA, that of which is listed with the description Microcircuit Memory; Manufactured by Advanced Micro Devices Inc and listed alongside the NSN 5962012488649, part number AM27S181A BJA is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : AM27S181A BJA | Manufacturer : Advanced Micro Devices Inc | ||
NSN Number : 5962-01-248-8649 (5962012488649) | |||
Item Name : Microcircuit Memory | CAGE Code : 34335 | ||
NIIN : 012488649 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number AM27S181A BJA, that of which is listed with the description Microcircuit Memory; Manufactured by Advanced Micro Devices Inc and listed alongside the NSN 5962012488649, part number AM27S181A BJA is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-248-8649 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012488649 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM HEAD 028 | 1 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 90.00 NANOSECONDS MAXIMUM ACCESS |
CZER | MEMORY DEVICE TYPE | PROM |
CZZZ | MEMORY CAPACITY | 1024K X 8 |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-81349/209 GOVERNMENT SPECIFICATION |
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