Part Number : AM2864AE 200 BXA | Manufacturer : Advanced Micro Devices Inc | ||
NSN : 5962-01-310-8690 (5962013108690) | |||
Item Name : Microcircuitmemory | CAGE Code : 34335 | ||
NIIN : 01-310-8690 (013108690) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA |
Thank you for taking an interest in part number AM2864AE 200 BXA, that of which is listed with the description Microcircuitmemory; Manufactured by Advanced Micro Devices Inc and listed alongside the NSN 5962013108690, part number AM2864AE 200 BXA is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : AM2864AE 200 BXA | Manufacturer : Advanced Micro Devices Inc | ||
NSN Number : 5962-01-310-8690 (5962013108690) | |||
Item Name : Microcircuitmemory | CAGE Code : 34335 | ||
NIIN : 013108690 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number AM2864AE 200 BXA, that of which is listed with the description Microcircuitmemory; Manufactured by Advanced Micro Devices Inc and listed alongside the NSN 5962013108690, part number AM2864AE 200 BXA is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-310-8690 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013108690 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.440 INCHES MINIMUM AND 1.500 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.090 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
ADAT | BODY WIDTH | 0.510 INCHES MINIMUM AND 0.550 INCHES MAXIMUM |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND ERASABLE AND W/ENABLE |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CQZP | INPUT CIRCUIT PATTERN | 24 INPUT |
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