Part Number : AM27S03A B2A | Manufacturer : Advanced Micro Devices Inc | ||
NSN : 5962-01-330-5519 (5962013305519) | |||
Item Name : Microcircuit Memory | CAGE Code : 34335 | ||
NIIN : 01-330-5519 (013305519) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA |
Thank you for taking an interest in part number AM27S03A B2A, that of which is listed with the description Microcircuit Memory; Manufactured by Advanced Micro Devices Inc and listed alongside the NSN 5962013305519, part number AM27S03A B2A is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : AM27S03A B2A | Manufacturer : Advanced Micro Devices Inc | ||
NSN Number : 5962-01-330-5519 (5962013305519) | |||
Item Name : Microcircuit Memory | CAGE Code : 34335 | ||
NIIN : 013305519 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number AM27S03A B2A, that of which is listed with the description Microcircuit Memory; Manufactured by Advanced Micro Devices Inc and listed alongside the NSN 5962013305519, part number AM27S03A B2A is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-330-5519 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013305519 | N | B | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
B | A | 0 | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
AM27S03A/B2A | 2 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/DECODED OUTPUT AND HIGH SPEED |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
CZER | MEMORY DEVICE TYPE | RAM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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