| Part Number : 310294P3 | Manufacturer : Bae Systems Inc | ||
| NSN : 5962-00-506-7606 (5962005067606) | |||
| Item Name : Microcircuit Memory | CAGE Code : 94117 | ||
| NIIN : 00-506-7606 (005067606) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 00 | Country : USA | ||
Thank you for taking an interest in part number 310294P3, that of which is listed with the description Microcircuit Memory; Manufactured by Bae Systems Inc and listed alongside the NSN 5962005067606, part number 310294P3 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : 310294P3 | Manufacturer : Bae Systems Inc | ||
| NSN Number : 5962-00-506-7606 (5962005067606) | |||
| Item Name : Microcircuit Memory | CAGE Code : 94117 | ||
| NIIN : 005067606 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number 310294P3, that of which is listed with the description Microcircuit Memory; Manufactured by Bae Systems Inc and listed alongside the NSN 5962005067606, part number 310294P3 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-506-7606 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 005067606 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | G | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| ROM/PROM | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.220 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.520 INCHES MINIMUM AND 0.550 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.090 INCHES MINIMUM AND 0.150 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND HIGH SPEED AND W/DECODED OUTPUT AND BIPOLAR AND PROGRAMMABLE AND EXPANDABLE AND WIRE-OR OUTPUTS AND W/ENABLE AND W/DISABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-015-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | GOLD |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.3 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | 94117-310294 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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