Part Number : A2XA1621 | Manufacturer : Fei Microwave Inc | ||
NSN : 5961-01-122-9171 (5961011229171) | |||
Item Name : Semiconductor Device Diode | CAGE Code : 21847 | ||
NIIN : 01-122-9171 (011229171) | |||
FSC Code : 5961 Semiconductor Devices and Associated Hardware | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 20589 | |||
NCB Code : 01 | Country : USA |
Thank you for taking an interest in part number A2XA1621, that of which is listed with the description Semiconductor Device Diode; Manufactured by Fei Microwave Inc and listed alongside the NSN 5961011229171, part number A2XA1621 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : A2XA1621 | Manufacturer : Fei Microwave Inc | ||
NSN Number : 5961-01-122-9171 (5961011229171) | |||
Item Name : Semiconductor Device Diode | CAGE Code : 21847 | ||
NIIN : 011229171 | |||
FSC CODE : 5961 Semiconductor Devices and Associated Hardware |
Thank you for taking an interest in part number A2XA1621, that of which is listed with the description Semiconductor Device Diode; Manufactured by Fei Microwave Inc and listed alongside the NSN 5961011229171, part number A2XA1621 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-122-9171 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 011229171 | N | |||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
A | ||||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
A2XA1621 | C | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
ADAV | OVERALL DIAMETER | 0.068 INCHES MINIMUM AND 0.076 INCHES MAXIMUM |
AXGY | MOUNTING METHOD | TERMINAL |
CTRD | POWER RATING PER CHARACTERISTIC | 150.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
MATT | MATERIAL | SILICON SEMICONDUCTOR |
TEST | TEST DATA DOCUMENT | 96906-MIS-STD-202 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). AND 96906-MIL-STD-750 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
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