Part Number : 08563-80009 | Manufacturer : Hewlett-Packard Company | ||
NSN : 5962-01-385-1570 (5962013851570) | |||
Item Name : Microcircuit Memory | CAGE Code : 28480 | ||
NIIN : 01-385-1570 (013851570) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA | ||
Alternate P/N: 0856380009 |
Thank you for taking an interest in part number 08563-80009, that of which is listed with the description Microcircuit Memory; Manufactured by Hewlett-Packard Company and listed alongside the NSN 5962013851570, part number 08563-80009 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : 08563-80009 | Manufacturer : Hewlett-Packard Company | ||
NSN Number : 5962-01-385-1570 (5962013851570) | |||
Item Name : Microcircuit Memory | CAGE Code : 28480 | ||
NIIN : 013851570 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number 08563-80009, that of which is listed with the description Microcircuit Memory; Manufactured by Hewlett-Packard Company and listed alongside the NSN 5962013851570, part number 08563-80009 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-385-1570 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013851570 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS NOMINAL ACCESS |
MRC | Decoded Requirement | Clear Text Reply |
CZER | Memory Device Type | PROM |
CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND PROGRAMMED |
CQSJ | Inclosure Material | CERAMIC |
ADAT | Body Width | 0.562 INCHES NOMINAL |
AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
ADAQ | Body Length | 1.625 INCHES NOMINAL |
ADAU | Body Height | 0.187 INCHES NOMINAL |
TTQY | Terminal Type And Quantity | 32 PRINTED CIRCUIT |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZES | Hybrid Technology Type | MONOLITHIC |
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