| Part Number : 8511874-757 | Manufacturer : Honeywell International Inc | ||
| NSN : 5962-01-330-5523 (5962013305523) | |||
| Item Name : Microcircuit Memory | CAGE Code : 07187 | ||
| NIIN : 01-330-5523 (013305523) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 01 | Country : USA | ||
| Alternate P/N: 8511874757 | |||
Thank you for taking an interest in part number 8511874-757, that of which is listed with the description Microcircuit Memory; Manufactured by Honeywell International Inc and listed alongside the NSN 5962013305523, part number 8511874-757 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : 8511874-757 | Manufacturer : Honeywell International Inc | ||
| NSN Number : 5962-01-330-5523 (5962013305523) | |||
| Item Name : Microcircuit Memory | CAGE Code : 07187 | ||
| NIIN : 013305523 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number 8511874-757, that of which is listed with the description Microcircuit Memory; Manufactured by Honeywell International Inc and listed alongside the NSN 5962013305523, part number 8511874-757 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-330-5523 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013305523 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT71256S45L32B | 2 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| ADAQ | BODY LENGTH | 0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| ADAT | BODY WIDTH | 0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.074 INCHES MINIMUM AND 0.086 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
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