| Part Number : IDT7200L30TDB | Manufacturer : Integrated Device Technology Inc | ||
| NSN : 5962-01-316-3166 (5962013163166) | |||
| Item Name : Microcircuit Memory | CAGE Code : 61772 | ||
| NIIN : 01-316-3166 (013163166) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 01 | Country : USA | ||
Thank you for taking an interest in part number IDT7200L30TDB, that of which is listed with the description Microcircuit Memory; Manufactured by Integrated Device Technology Inc and listed alongside the NSN 5962013163166, part number IDT7200L30TDB is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : IDT7200L30TDB | Manufacturer : Integrated Device Technology Inc | ||
| NSN Number : 5962-01-316-3166 (5962013163166) | |||
| Item Name : Microcircuit Memory | CAGE Code : 61772 | ||
| NIIN : 013163166 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number IDT7200L30TDB, that of which is listed with the description Microcircuit Memory; Manufactured by Integrated Device Technology Inc and listed alongside the NSN 5962013163166, part number IDT7200L30TDB is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-316-3166 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013163166 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-8966606XX | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZER | MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| FEAT | SPECIAL FEATURES | FIRST-IN FIRST-OUT RAM 256X9 |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| ADAQ | BODY LENGTH | 1.485 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.225 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | TRAINING SET,COUNTERMEASURES SIGNALS AN/MSR-T4 TRA |
| CBBL | FEATURES PROVIDED | ASYNCHRONOUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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