| Part Number : D1103 | Manufacturer : Intel Corporation | ||
| NSN : 5962-00-530-4664 (5962005304664) | |||
| Item Name : Microcircuit Memory | CAGE Code : 34649 | ||
| NIIN : 00-530-4664 (005304664) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 00 | Country : USA | ||
Thank you for taking an interest in part number D1103, that of which is listed with the description Microcircuit Memory; Manufactured by Intel Corporation and listed alongside the NSN 5962005304664, part number D1103 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : D1103 | Manufacturer : Intel Corporation | ||
| NSN Number : 5962-00-530-4664 (5962005304664) | |||
| Item Name : Microcircuit Memory | CAGE Code : 34649 | ||
| NIIN : 005304664 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number D1103, that of which is listed with the description Microcircuit Memory; Manufactured by Intel Corporation and listed alongside the NSN 5962005304664, part number D1103 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-530-4664 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 005304664 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| C1103 | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.890 INCHES MINIMUM AND 0.960 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.275 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.025 INCHES MINIMUM AND 0.150 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 400.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -25.0/85.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/ENABLE AND LOW POWER AND W/STORAGE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 94117-310180 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
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