Part Number : HM5-8832-8 | Manufacturer : Intersil Corporation | ||
NSN : 5962-01-306-0897 (5962013060897) | |||
Item Name : Microcircuit Memory | CAGE Code : 34371 | ||
NIIN : 01-306-0897 (013060897) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA | ||
Alternate P/N: HM588328 |
Thank you for taking an interest in part number HM5-8832-8, that of which is listed with the description Microcircuit Memory; Manufactured by Intersil Corporation and listed alongside the NSN 5962013060897, part number HM5-8832-8 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : HM5-8832-8 | Manufacturer : Intersil Corporation | ||
NSN Number : 5962-01-306-0897 (5962013060897) | |||
Item Name : Microcircuit Memory | CAGE Code : 34371 | ||
NIIN : 013060897 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number HM5-8832-8, that of which is listed with the description Microcircuit Memory; Manufactured by Intersil Corporation and listed alongside the NSN 5962013060897, part number HM5-8832-8 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-306-0897 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013060897 | N | B | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
B | A | 0 | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
AM1189-001 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.386 INCHES MINIMUM AND 1.414 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.543 INCHES MINIMUM AND 0.615 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.192 INCHES MINIMUM AND 0.271 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/ENABLE |
CZEQ | TIME RATING PER CHACTERISTIC | 180.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 180.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 8.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
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