| Part Number : STSWDC04-3 | Manufacturer : Lockheed Martin Corporation | ||
| NSN : 5961-01-332-8095 (5961013328095) | |||
| Item Name : Semiconductor Devic | CAGE Code : 98897 | ||
| NIIN : 01-332-8095 (013328095) | |||
| FSC Code : 5961 Semiconductor Devices and Associated Hardware | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 61962 | |||
| NCB Code : 01 | Country : USA | ||
| Alternate P/N: STSWDC043 | |||
Thank you for taking an interest in part number STSWDC04-3, that of which is listed with the description Semiconductor Devic; Manufactured by Lockheed Martin Corporation and listed alongside the NSN 5961013328095, part number STSWDC04-3 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : STSWDC04-3 | Manufacturer : Lockheed Martin Corporation | ||
| NSN Number : 5961-01-332-8095 (5961013328095) | |||
| Item Name : Semiconductor Devic | CAGE Code : 98897 | ||
| NIIN : 013328095 | |||
| FSC CODE : 5961 Semiconductor Devices and Associated Hardware | |||
Thank you for taking an interest in part number STSWDC04-3, that of which is listed with the description Semiconductor Devic; Manufactured by Lockheed Martin Corporation and listed alongside the NSN 5961013328095, part number STSWDC04-3 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-332-8095 Item PartTypeName: SEMICONDUCTOR DEVICES,UNITIZED | 5961 | 013328095 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | G | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| STSWDC04-3 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | OVERALL HEIGHT | 0.030 INCHES MINIMUM AND 0.040 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.037 INCHES MINIMUM AND 0.043 INCHES MAXIMUM |
| ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 60.0 MAXIMUM REVERSE VOLTAGE,DC ALL SEMICONDUCTOR DEVICE DIODE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 20.00 MILLIAMPERES FORWARD CURRENT,AVERAGE ABSOLUTE ALL SEMICONDUCTOR DEVICE DIODE |
| FEAT | SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| PRMT | PRECIOUS MATERIAL | GOLD |
| ABHP | OVERALL LENGTH | 0.072 INCHES MINIMUM AND 0.078 INCHES MAXIMUM |
| PMLC | PRECIOUS MATERIAL AND LOCATION | EUTECTIC DIE BONDS SURFACES TERMINALS AND LAND AREAS SURFACES GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | 4 BONDING PAD |
| AXGY | MOUNTING METHOD | TERMINAL |
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