Part Number : LTC108FMB25 | Manufacturer : Logic Devices Incorporated | ||
NSN : 5962-01-443-5059 (5962014435059) | |||
Item Name : Microcircuit Memory | CAGE Code : 65896 | ||
NIIN : 01-443-5059 (014435059) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA |
Thank you for taking an interest in part number LTC108FMB25, that of which is listed with the description Microcircuit Memory; Manufactured by Logic Devices Incorporated and listed alongside the NSN 5962014435059, part number LTC108FMB25 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : LTC108FMB25 | Manufacturer : Logic Devices Incorporated | ||
NSN Number : 5962-01-443-5059 (5962014435059) | |||
Item Name : Microcircuit Memory | CAGE Code : 65896 | ||
NIIN : 014435059 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number LTC108FMB25, that of which is listed with the description Microcircuit Memory; Manufactured by Logic Devices Incorporated and listed alongside the NSN 5962014435059, part number LTC108FMB25 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-443-5059 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 014435059 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
LTC108FMB25 | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
MRC | Decoded Requirement | Clear Text Reply |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZER | Memory Device Type | RAM |
CTQX | Current Rating Per Characteristic | 120.00 MILLIAMPERES NOMINAL INPUT |
CZEQ | Time Rating Per Chacteristic | 85.00 NANOSECONDS NOMINAL ACCESS |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
AFJQ | Storage Temp Range | -65.0 TO 155.0 DEG CELSIUS |
CQSJ | Inclosure Material | CERAMIC |
ADAT | Body Width | 0.400 INCHES MINIMUM AND 0.420 INCHES MAXIMUM |
CWSG | Terminal Surface Treatment | SOLDER |
CQSZ | Inclosure Configuration | FLAT PACK |
TTQY | Terminal Type And Quantity | 32 FLAT LEADS |
ADAQ | Body Length | 0.830 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
ADAU | Body Height | 0.125 INCHES MAXIMUM |
CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS NOMINAL TOTAL SUPPLY |
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
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