| Part Number : UDZ709 | Manufacturer : Micro Uspd Inc | ||
| NSN : 5961-01-211-2004 (5961012112004) | |||
| Item Name : Semiconductor Device Diode | CAGE Code : 12969 | ||
| NIIN : 01-211-2004 (012112004) | |||
| FSC Code : 5961 Semiconductor Devices and Associated Hardware | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 20589 | |||
| NCB Code : 01 | Country : USA | ||
Thank you for taking an interest in part number UDZ709, that of which is listed with the description Semiconductor Device Diode; Manufactured by Micro Uspd Inc and listed alongside the NSN 5961012112004, part number UDZ709 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
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| Part Number : UDZ709 | Manufacturer : Micro Uspd Inc | ||
| NSN Number : 5961-01-211-2004 (5961012112004) | |||
| Item Name : Semiconductor Device Diode | CAGE Code : 12969 | ||
| NIIN : 012112004 | |||
| FSC CODE : 5961 Semiconductor Devices and Associated Hardware | |||
Thank you for taking an interest in part number UDZ709, that of which is listed with the description Semiconductor Device Diode; Manufactured by Micro Uspd Inc and listed alongside the NSN 5961012112004, part number UDZ709 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-211-2004 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 012112004 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 033469-1 | 2 | 2 | 1 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.450 INCHES MAXIMUM |
| AGAV | END ITEM IDENTIFICATION | B1B AIRCRAFT |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 DEG CELSIUS AMBIENT AIR |
| MATT | MATERIAL | GLASS INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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