Part Number : 62030-001 | Manufacturer : Micropac Industries Inc | ||
NSN : 5961-01-184-5458 (5961011845458) | |||
Item Name : Semiconductor Device Photo | CAGE Code : 31757 | ||
NIIN : 01-184-5458 (011845458) | |||
FSC Code : 5961 Semiconductor Devices and Associated Hardware | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 20587 | |||
NCB Code : 01 | Country : USA | ||
Alternate P/N: 62030001 |
Thank you for taking an interest in part number 62030-001, that of which is listed with the description Semiconductor Device Photo; Manufactured by Micropac Industries Inc and listed alongside the NSN 5961011845458, part number 62030-001 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : 62030-001 | Manufacturer : Micropac Industries Inc | ||
NSN Number : 5961-01-184-5458 (5961011845458) | |||
Item Name : Semiconductor Device Photo | CAGE Code : 31757 | ||
NIIN : 011845458 | |||
FSC CODE : 5961 Semiconductor Devices and Associated Hardware |
Thank you for taking an interest in part number 62030-001, that of which is listed with the description Semiconductor Device Photo; Manufactured by Micropac Industries Inc and listed alongside the NSN 5961011845458, part number 62030-001 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-184-5458 Item PartTypeName: SEMICONDUCTOR DEVICE,PHOTO | 5961 | 011845458 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
SLED96 | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | CERAMIC |
ABHP | OVERALL LENGTH | 0.125 INCHES MAXIMUM |
ADAV | OVERALL DIAMETER | 0.093 INCHES MAXIMUM |
ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
AXGY | MOUNTING METHOD | PRESS FIT |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | GALLIUM ARSENIDE |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 3.0 MAXIMUM REVERSE VOLTAGE,DC |
CTQX | CURRENT RATING PER CHARACTERISTIC | 150.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET |
CTRD | POWER RATING PER CHARACTERISTIC | 350.0 MILLIWATTS SMALL-SIGNAL INPUT POWER,COMMON-COLLECTOR ABSOLUTE |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR |
FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PN |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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