| Part Number : JAN1N5619 | Manufacturer : Microsemi Corporation | ||
| NSN : 5961-01-349-0240 (5961013490240) | |||
| Item Name : Semiconductor Device Diode | CAGE Code : 14552 | ||
| NIIN : 01-349-0240 (013490240) | |||
| FSC Code : 5961 Semiconductor Devices and Associated Hardware | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 20589 | |||
| NCB Code : 01 | Country : USA | ||
Thank you for taking an interest in part number JAN1N5619, that of which is listed with the description Semiconductor Device Diode; Manufactured by Microsemi Corporation and listed alongside the NSN 5961013490240, part number JAN1N5619 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : JAN1N5619 | Manufacturer : Microsemi Corporation | ||
| NSN Number : 5961-01-349-0240 (5961013490240) | |||
| Item Name : Semiconductor Device Diode | CAGE Code : 14552 | ||
| NIIN : 013490240 | |||
| FSC CODE : 5961 Semiconductor Devices and Associated Hardware | |||
Thank you for taking an interest in part number JAN1N5619, that of which is listed with the description Semiconductor Device Diode; Manufactured by Microsemi Corporation and listed alongside the NSN 5961013490240, part number JAN1N5619 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-349-0240 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 013490240 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| JAN1N5619 | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CRTL | CRITICALITY CODE JUSTIFICATION | ZZZY |
| FEAT | SPECIAL FEATURES | ITEM MUST COMPLY WITH REQUIREMENTS OF DEFENSE SUPPLY CENTER COLUMBUS PRODUCTION STANDARD NO LO4429; JUNCTION PATTERN ARRANGEMENT: PN |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| ZZZY | REFERENCE NUMBER DIFFERENTIATING CHARACTERISTICS | BREFERENCE NUMBER DIFFERENTIATING MATERIAL WILL BE IN ACCORDANCE WITH NAVAL INVENTORY CONTROL POINT ACTIVITY HX QUALITY CONTROL. MANUFACTURING AND TESTING SPECIFICATIONS AVAILABLE AT THE DLA ICP. |
| ABHP | OVERALL LENGTH | 0.130 INCHES MINIMUM AND 0.225 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM AND 1.300 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.065 INCHES MINIMUM AND 0.110 INCHES MAXIMUM |
| AFZC | FUNCTION FOR WHICH DESIGNED | RECTIFIER |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 DEG CELSIUS AMBIENT AIR |
| MATT | MATERIAL | GLASS INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 600.0 MAXIMUM REVERSE VOLTAGE,INSTANTANEOUS AND 600.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE |
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