| Part Number : 5330-1F883C | Manufacturer : Mmi Amd | ||
| NSN : 5962-01-310-7307 (5962013107307) | |||
| Item Name : Microcircuit Memory | CAGE Code : 50364 | ||
| NIIN : 01-310-7307 (013107307) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 01 | Country : USA | ||
| Alternate P/N: 53301F883C | |||
Thank you for taking an interest in part number 5330-1F883C, that of which is listed with the description Microcircuit Memory; Manufactured by Mmi Amd and listed alongside the NSN 5962013107307, part number 5330-1F883C is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : 5330-1F883C | Manufacturer : Mmi Amd | ||
| NSN Number : 5962-01-310-7307 (5962013107307) | |||
| Item Name : Microcircuit Memory | CAGE Code : 50364 | ||
| NIIN : 013107307 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number 5330-1F883C, that of which is listed with the description Microcircuit Memory; Manufactured by Mmi Amd and listed alongside the NSN 5962013107307, part number 5330-1F883C is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-310-7307 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013107307 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 82S23/BFA | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.285 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 332.8 MILLIWATTS |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND W/OPEN COLLECTOR AND BIPOLAR AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
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