Part Number : 53S3281BW883B | Manufacturer : Mmi Amd | ||
NSN : 5962-01-332-0717 (5962013320717) | |||
Item Name : Microcircuit Memory | CAGE Code : 50364 | ||
NIIN : 01-332-0717 (013320717) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA |
Thank you for taking an interest in part number 53S3281BW883B, that of which is listed with the description Microcircuit Memory; Manufactured by Mmi Amd and listed alongside the NSN 5962013320717, part number 53S3281BW883B is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : 53S3281BW883B | Manufacturer : Mmi Amd | ||
NSN Number : 5962-01-332-0717 (5962013320717) | |||
Item Name : Microcircuit Memory | CAGE Code : 50364 | ||
NIIN : 013320717 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number 53S3281BW883B, that of which is listed with the description Microcircuit Memory; Manufactured by Mmi Amd and listed alongside the NSN 5962013320717, part number 53S3281BW883B is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-332-0717 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013320717 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAT | BODY WIDTH | 0.404 INCHES MINIMUM AND 0.420 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.090 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
ADAQ | BODY LENGTH | 0.595 INCHES MINIMUM AND 0.630 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 FLAT LEADS |
ABMK | OVERALL WIDTH | 0.720 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE |
CZER | MEMORY DEVICE TYPE | ROM |
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