| Part Number : 53S881J 883B | Manufacturer : Mmi Amd | ||
| NSN : 5962-01-337-3530 (5962013373530) | |||
| Item Name : Microcircuit Memory | CAGE Code : 50364 | ||
| NIIN : 01-337-3530 (013373530) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 01 | Country : USA | ||
Thank you for taking an interest in part number 53S881J 883B, that of which is listed with the description Microcircuit Memory; Manufactured by Mmi Amd and listed alongside the NSN 5962013373530, part number 53S881J 883B is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : 53S881J 883B | Manufacturer : Mmi Amd | ||
| NSN Number : 5962-01-337-3530 (5962013373530) | |||
| Item Name : Microcircuit Memory | CAGE Code : 50364 | ||
| NIIN : 013373530 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number 53S881J 883B, that of which is listed with the description Microcircuit Memory; Manufactured by Mmi Amd and listed alongside the NSN 5962013373530, part number 53S881J 883B is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-337-3530 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013373530 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 82S181BJA | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAU | BODY HEIGHT | 0.090 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| ADAQ | BODY LENGTH | 1.190 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 830.0 MILLIWATTS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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