| Part Number : X2212 | Manufacturer : Nsgdatacom Inc | ||
| NSN : 5962-01-165-0870 (5962011650870) | |||
| Item Name : Microcircuit Memory | CAGE Code : 15230 | ||
| NIIN : 01-165-0870 (011650870) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 01 | Country : USA | ||
Thank you for taking an interest in part number X2212, that of which is listed with the description Microcircuit Memory; Manufactured by Nsgdatacom Inc and listed alongside the NSN 5962011650870, part number X2212 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : X2212 | Manufacturer : Nsgdatacom Inc | ||
| NSN Number : 5962-01-165-0870 (5962011650870) | |||
| Item Name : Microcircuit Memory | CAGE Code : 15230 | ||
| NIIN : 011650870 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number X2212, that of which is listed with the description Microcircuit Memory; Manufactured by Nsgdatacom Inc and listed alongside the NSN 5962011650870, part number X2212 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-165-0870 Item Description: Microcircuit Memory | 5962 | 011650870 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| X2212 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CSWJ | (NON-CORE DATA) WORD QUANTITY | 512 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| AFGA | OPERATING TEMP RANGE | -0.0 TO 70.0 DEG CELSIUS |
| CRHL | (NON-CORE DATA) BIT QUANTITY | 2048 |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CBBL | FEATURES PROVIDED | STATIC OPERATION AND ERASABLE |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| AGAV | III END ITEM IDENTIFICATION | 5895-01-129-1827 COMMUNICATIONS CENTRAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| CZER | MEMORY DEVICE TYPE | ROM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 220.0 MILLIWATTS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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