Part Number : S82S185F 883C | Manufacturer : Philips Semiconductors Ltd | ||
NSN : 5962-01-237-2519 (5962012372519) | |||
Item Name : Microcircuit Memory | CAGE Code : 18324 | ||
NIIN : 01-237-2519 (012372519) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA |
Thank you for taking an interest in part number S82S185F 883C, that of which is listed with the description Microcircuit Memory; Manufactured by Philips Semiconductors Ltd and listed alongside the NSN 5962012372519, part number S82S185F 883C is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : S82S185F 883C | Manufacturer : Philips Semiconductors Ltd | ||
NSN Number : 5962-01-237-2519 (5962012372519) | |||
Item Name : Microcircuit Memory | CAGE Code : 18324 | ||
NIIN : 012372519 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number S82S185F 883C, that of which is listed with the description Microcircuit Memory; Manufactured by Philips Semiconductors Ltd and listed alongside the NSN 5962012372519, part number S82S185F 883C is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-237-2519 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012372519 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM FAMILY 007 | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.930 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
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