Part Number : 82S100 B3A | Manufacturer : Philips Semiconductors Ltd | ||
NSN : 5962-01-414-2674 (5962014142674) | |||
Item Name : Microcircuit Memory | CAGE Code : 18324 | ||
NIIN : 01-414-2674 (014142674) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA |
Thank you for taking an interest in part number 82S100 B3A, that of which is listed with the description Microcircuit Memory; Manufactured by Philips Semiconductors Ltd and listed alongside the NSN 5962014142674, part number 82S100 B3A is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : 82S100 B3A | Manufacturer : Philips Semiconductors Ltd | ||
NSN Number : 5962-01-414-2674 (5962014142674) | |||
Item Name : Microcircuit Memory | CAGE Code : 18324 | ||
NIIN : 014142674 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number 82S100 B3A, that of which is listed with the description Microcircuit Memory; Manufactured by Philips Semiconductors Ltd and listed alongside the NSN 5962014142674, part number 82S100 B3A is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-414-2674 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 014142674 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM FAMILY 230 | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS NOMINAL POWER SOURCE |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | PROGRAMMED PAL |
TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM ACCESS |
CZER | MEMORY DEVICE TYPE | PAL |
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