| Part Number : G504229-6 | Manufacturer : Raytheon Company | ||
| NSN : 5962-01-363-9534 (5962013639534) | |||
| Item Name : Microcircuit Memory | CAGE Code : 3B150 | ||
| NIIN : 01-363-9534 (013639534) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 01 | Country : USA | ||
| Alternate P/N: G5042296 | |||
Thank you for taking an interest in part number G504229-6, that of which is listed with the description Microcircuit Memory; Manufactured by Raytheon Company and listed alongside the NSN 5962013639534, part number G504229-6 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : G504229-6 | Manufacturer : Raytheon Company | ||
| NSN Number : 5962-01-363-9534 (5962013639534) | |||
| Item Name : Microcircuit Memory | CAGE Code : 3B150 | ||
| NIIN : 013639534 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number G504229-6, that of which is listed with the description Microcircuit Memory; Manufactured by Raytheon Company and listed alongside the NSN 5962013639534, part number G504229-6 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN | 
|---|---|---|---|---|---|---|
| 5962-01-363-9534 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013639534 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC | 
| ROM/PROM | 5 | 1 | 5 | 
| MRC | Criteria | Characteristic | 
|---|---|---|
| CQSJ | INCLOSURE MATERIAL | CERAMIC | 
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC | 
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM APPLIED AND 7.0 VOLTS MINIMUM APPLIED | 
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS | 
| AFGA | OPERATING TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS | 
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT | 
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER | 
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). | 
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE | 
| CZER | MEMORY DEVICE TYPE | PROM | 
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT | 
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