Part Number : LSM3L | Manufacturer : Refac Electronics Corp | ||
NSN : 5961-01-042-3338 (5961010423338) | |||
Item Name : Semiconductor Device Photo | CAGE Code : 28564 | ||
NIIN : 01-042-3338 (010423338) | |||
FSC Code : 5961 Semiconductor Devices and Associated Hardware | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 20587 | |||
NCB Code : 01 | Country : USA |
Thank you for taking an interest in part number LSM3L, that of which is listed with the description Semiconductor Device Photo; Manufactured by Refac Electronics Corp and listed alongside the NSN 5961010423338, part number LSM3L is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : LSM3L | Manufacturer : Refac Electronics Corp | ||
NSN Number : 5961-01-042-3338 (5961010423338) | |||
Item Name : Semiconductor Device Photo | CAGE Code : 28564 | ||
NIIN : 010423338 | |||
FSC CODE : 5961 Semiconductor Devices and Associated Hardware |
Thank you for taking an interest in part number LSM3L, that of which is listed with the description Semiconductor Device Photo; Manufactured by Refac Electronics Corp and listed alongside the NSN 5961010423338, part number LSM3L is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-042-3338 Item PartTypeName: SEMICONDUCTOR DEVICE,PHOTO | 5961 | 010423338 | 0 | N | A | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | A | U | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
266-100015-002 | 5 | 2 | 1 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | PLASTIC |
AXGY | MOUNTING METHOD | TERMINAL |
CTMZ | SEMICONDUCTOR MATERIAL | GALLIUM ARSENIDE PHOSPHIDE |
FEAT | SPECIAL FEATURES | MOUNTED IN A RED DIFFUSED PLASTICPACKAGE |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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