Part Number : ZA5803 | Manufacturer : Texas Instruments Inc | ||
NSN : 5962-00-150-1150 (5962001501150) | |||
Item Name : Microcircuit Memory | CAGE Code : 01295 | ||
NIIN : 00-150-1150 (001501150) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 00 | Country : USA |
Thank you for taking an interest in part number ZA5803, that of which is listed with the description Microcircuit Memory; Manufactured by Texas Instruments Inc and listed alongside the NSN 5962001501150, part number ZA5803 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
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Part Number : ZA5803 | Manufacturer : Texas Instruments Inc | ||
NSN Number : 5962-00-150-1150 (5962001501150) | |||
Item Name : Microcircuit Memory | CAGE Code : 01295 | ||
NIIN : 001501150 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number ZA5803, that of which is listed with the description Microcircuit Memory; Manufactured by Texas Instruments Inc and listed alongside the NSN 5962001501150, part number ZA5803 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-00-150-1150 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 001501150 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
373729-3 | C | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.3 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 00752-373729 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
ADAQ | BODY LENGTH | 1.315 INCHES MINIMUM AND 1.415 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.590 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.125 INCHES MINIMUM AND 0.165 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 800.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -25.0/85.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
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