| Part Number : JBP18S03XMFD | Manufacturer : Texas Instruments Inc | ||
| NSN : 5962-01-326-4310 (5962013264310) | |||
| Item Name : Microcircuit Memory | CAGE Code : 01295 | ||
| NIIN : 01-326-4310 (013264310) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 01 | Country : USA | ||
Thank you for taking an interest in part number JBP18S03XMFD, that of which is listed with the description Microcircuit Memory; Manufactured by Texas Instruments Inc and listed alongside the NSN 5962013264310, part number JBP18S03XMFD is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : JBP18S03XMFD | Manufacturer : Texas Instruments Inc | ||
| NSN Number : 5962-01-326-4310 (5962013264310) | |||
| Item Name : Microcircuit Memory | CAGE Code : 01295 | ||
| NIIN : 013264310 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number JBP18S03XMFD, that of which is listed with the description Microcircuit Memory; Manufactured by Texas Instruments Inc and listed alongside the NSN 5962013264310, part number JBP18S03XMFD is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-326-4310 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013264310 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| ROM/PROM | 2 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZER | MEMORY DEVICE TYPE | ROM |
| ADAQ | BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.080 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| ADAT | BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND BIPOLAR AND ELECTROSTATIC SENSITIVE |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | 1260-01-208-6448 MAST MOUNTED SI |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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