| Part Number : X28256D-35 | Manufacturer : Xicor Inc | ||
| NSN : 5962-01-337-7445 (5962013377445) | |||
| Item Name : Microcircuit Memory | CAGE Code : 60395 | ||
| NIIN : 01-337-7445 (013377445) | |||
| FSC Code : 5962 Microcircuits Electronic | |||
| FSG Code : 59 Electrical and Electronic Equipment Components | |||
| INC Code : 41015 | |||
| NCB Code : 01 | Country : USA | ||
| Alternate P/N: X28256D35 | |||
Thank you for taking an interest in part number X28256D-35, that of which is listed with the description Microcircuit Memory; Manufactured by Xicor Inc and listed alongside the NSN 5962013377445, part number X28256D-35 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| Part Number : X28256D-35 | Manufacturer : Xicor Inc | ||
| NSN Number : 5962-01-337-7445 (5962013377445) | |||
| Item Name : Microcircuit Memory | CAGE Code : 60395 | ||
| NIIN : 013377445 | |||
| FSC CODE : 5962 Microcircuits Electronic | |||
Thank you for taking an interest in part number X28256D-35, that of which is listed with the description Microcircuit Memory; Manufactured by Xicor Inc and listed alongside the NSN 5962013377445, part number X28256D-35 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-337-7445 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013377445 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| X28256D-35 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | 0.0/70.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND 3-STATE OUTPUT AND W/ENABLE AND ERASABLE |
| CZEQ | TIME RATING PER CHACTERISTIC | 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 18 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| ADAQ | BODY LENGTH | 1.300 INCHES MINIMUM AND 1.520 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.475 INCHES MINIMUM AND 0.625 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.303 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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