Part Number : XC3090-70PG175I0041 | Manufacturer : Xilinx Inc | ||
NSN : 5962-01-380-6218 (5962013806218) | |||
Item Name : Microcircuit Memory | CAGE Code : 68994 | ||
NIIN : 01-380-6218 (013806218) | |||
FSC Code : 5962 Microcircuits Electronic | |||
FSG Code : 59 Electrical and Electronic Equipment Components | |||
INC Code : 41015 | |||
NCB Code : 01 | Country : USA | ||
Alternate P/N: XC309070PG175I0041 |
Thank you for taking an interest in part number XC3090-70PG175I0041, that of which is listed with the description Microcircuit Memory; Manufactured by Xilinx Inc and listed alongside the NSN 5962013806218, part number XC3090-70PG175I0041 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
Part Number : XC3090-70PG175I0041 | Manufacturer : Xilinx Inc | ||
NSN Number : 5962-01-380-6218 (5962013806218) | |||
Item Name : Microcircuit Memory | CAGE Code : 68994 | ||
NIIN : 013806218 | |||
FSC CODE : 5962 Microcircuits Electronic |
Thank you for taking an interest in part number XC3090-70PG175I0041, that of which is listed with the description Microcircuit Memory; Manufactured by Xilinx Inc and listed alongside the NSN 5962013806218, part number XC3090-70PG175I0041 is available for immediate purchase on our website. As such, to learn more about this offering while receiving a competitive quote for your comparisons, be sure to fill out and submit the RFQ form presented on this page. Within 15 minutes of us receiving and reviewing a completed form, a member of our staff will contact you to present a tailored solution for your comparisons.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-380-6218 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013806218 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | G | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
XC3090-70PG175I0041 | 3 | 8 | E |
MRC | Criteria | Characteristic |
---|---|---|
CZER | Memory Device Type | PAL |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CQSJ | Inclosure Material | CERAMIC |
CBBL | Features Provided | BURN IN AND ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMABLE |
PMLC | Precious Material And Location | TERMINALS GOLD |
CQZP | Input Circuit Pattern | 64 INPUT AND 10 INPUT |
CWSG | Terminal Surface Treatment | GOLD |
CQSZ | Inclosure Configuration | LEADED CHIP CARRIER |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
PRMT | Precious Material | GOLD |
AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
TTQY | Terminal Type And Quantity | 175 FLAT LEADS |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
MRC | Decoded Requirement | Clear Text Reply |
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