On July 15th, 2016 Steve Bush wrote an article on Electronics Weekly talking about how the French semiconductor Leti is working with their research development team in order to create a 3D network chip to improve fast computing. The reason behind this is so that data and be transferred between stacked die. Another way to transfer is across die on the silicon inter-poser. Not only this is very effective for the company but it is also not too costly.


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