Fairview Microwave,a leading provider of high-quality RF and microwave components including, adapters, connecters, attenuators, coaxial cables, and terminators, just announced the release of its not 16 voltage-controlled oscillator models. This model covers bands from 10 MHz to 4350 MHz. An oscillator which just generates voltages by nonmechanical means. The new model is unlike the old traditional one single fixed frequency microwave. The VCO’s allow the frequency of the output signal to vary significantly by adjusting amplitude of tuning voltage. These RF components are used in military electronics, meaning they are heavy duty, reliable and work fantastically. These RF components are also used in SATCOM test and measurement and wireless communications.


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Rohm Semiconductor is introducing a new SiC technology that will be in Formula E. SiC stands for silicon carbide which will be in the first face of the Formula E season which is being held in Hong Kong. Rohm Semiconductor, is partnering up with Venturi Formula E team. This will help in the all-electric racing series. Rohm Semiconductors is planning to use the SiC Technology in order to make their power electronics more efficient, smaller, stronger, and faster.


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Adafruit is a privately-owned company that is based in the US. Their focus is on designing and manufacturing open source electronic hardware. They are always up to date and are always trying to come with different ways to design their products. It is a competitive field, therefor they always try to design products that are unique and reliable. Because if their competitive products and great service RS has signed a distribution agreement, where Adafruit is supplying hardware, tools, equipment and electronics to makers and hobbyists.


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Infineon Technologies are bringing new hall sensors that are much smaller in size and they are more cost effective. This is good for the environment as well as for the consumer. The new hall sensors not only preserve the material by reducing the size of the sensor but they also reduce the size of the circuit boards they used in, this makes technology as usual advance in the right direction in making technology much smaller and more efficient. Power consumption is even reduced by almost 50% compared to the older version of the hall sensor. This is very useful for the energy efficient systems that are looking for stable magnetic switching points, robustness and precision.


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Harwin, the manufacturer of some of the most reliable interconnects and PCB hardware in the industry, has just opened a new industrial center in Portsmouth. This project increased Harwin’s floor space at this location by 33%, at a cost of nearly £3m.


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Qualcomm has charted a plan to bring 5G services and enhance mobile broadband. Current versions of the prototype system for the 5G New Radio (NR) speculate of a possible two stage introduction of 5G. The system operates in the sub-6GHz spectrum bands, not in the frequency bands expected of 28-65GHz. To reach this, the market has to patiently wait as new technology for the T- Centric 5G program advances that will help it reach the expected data capabilities. 5G will pave the way for changes in networking and communication standards that are sure to benefit the next generation of systems. Those beneficiaries include those in the motorized, manufacturing, and health sectors.


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On May 6th 2016, Richard Wilson released an article on Electronics Weekly talking about how Intel i3 processors will be scaling for embedded modules that are COM. Intel has created and designed the XMC module that will come with an envelope that is conduction cooled. This Conduction cooled envelope is appropriate for carriers that are considered either open standard or custom. This includes carriers such as VPX and VME.


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Mercury Systems has just announced that the company received a $4.7 million dollar contract from the U.S. Government facility for their advanced digital transceivers to be used in an electronic warfare application capacity. Mercury Systems is expected to deliver the order which was booked during the company’s fiscal 2016 fourth quarter over the next several quarters spanning the next couple of years.


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Xerox Corporation, the American global corporation which offers business services as well as document technology products, has recently made the decision to improve techniques for production of smart devices through the use of 3D printing.  The Xerox Corporation is currently working on developing the necessary electronics in order to utilize 3D printing processes to create smart devices. According to the lead of the Novel and Printed Electronics program at the Xerox Corporation’s Palo Alto Research Center (PARC), Janos Veres, the company is diligently working to create electronics 3D printing technologies which will enable for the creation of smart devices of any size or shape.


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Intel Corporation, one of the globe’s highest valued and largest semiconductor chip maker headquartered in Santa Clara, California, has recently announced that they will be exiting the tablet mobile as well as smartphone SoC business as the company has decided to end its struggling Atom chip product family. The Intel Corporation made this announcement in early April as the company continues to progress with a significant restricting plan. Some of the discontinued products include the Cherry Trail, the Broxton, as well as the SoFIA.


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