Michelin NZG Radial Technology Tires Equipped on Boeing 777-300 ER

Beginning in July 2016, Michelin Aircraft Tire Company will be the main supplier on the final assembly line for the Boeing 777-300ER, the 777-200LR, and the 777 Cargo. These carriers will be flying over 7370 nautical miles and can transport up to 400 passengers per flight.  President Frank Moreau of the Michelin Aircraft Tire Company is “proud to have been selected by Boeing as its official partner”.

Michelin’s newly patented Near Zero Growth (NZG) radial tires will be affixed on the main landing gears.  The NZG radial tires are set to offer a low cost of ownership, the highest level of safety, and a long tread life. Michelin radial tires were part of the Boeing lists of aircrafts: 737, 747,787, and 777.

Boeing awarded Michelin “Supplier of the Year” award in April 2015. This certification allows Michelin to continue to dominate with performance and quality with their radial tire technology.  These NSG tires provide weight savings that reduce fuel consumption. Also, they improve wear significantly based on the number of landings versus the nylon radial tires. Most importantly, the tires are more reliable, increasing resistance to damage towards the tires from foreign objects.

The addition to The Michelin NZG Radial Technology Tires on Boeing’s carriers continues an everlasting partnership between two of the most prominent companies in the aerospace  industries. Manufacturing will be located in Bourges, France, which is the location of the worldwide hub for Michelin’s radial technology aircraft tire plant.

ASAP Semiconductor is a leading supplier of Aerospace Industry Parts and has the resources to supply an array of Daher aircraft products. We provide our customers with a simplified and speedy procurement process. We ensure that our customers production lines and prototype builds are always up and running effectively. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com call us toll free at 1-714-705-4780.


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Honeywell and United Technologies Discuss Potential Merger

Honeywell International and United Technologies Corporation, the aerospace giants, have recently held talks regarding a potential merger which would create for a $94 billion sales conglomerate. These talks have been taking place over the span of the last two weeks, and have been focusing on a deal in which Honeywell International parts would offer a premium in the form of cash and in stock, for the smaller United Technologies Corporation.

While there is no guarantee that these discussions will ultimately lead to a deal, there are significant concerns regarding the approval of an antitrust review. Honeywell International and United Technologies Corporation offer and provide such a wide range of materials and resources for the aviation and aerospace industries. It is likely that they will face opposition from other aerospace giants such as Airbus as well as Boeing. At this point, it seems as though the outcome of these talks are uncertain.

“Earlier last year, when UTX was larger in value than Honeywell, UTX CEO Greg Hayes approached his counterpart at Honeywell, David Cote, about the possibility of merging the two companies,” stated David Faber at CNBC. “Those discussions centered on a deal that represented a merger of equals, but would have had UTX management in control, according to people close to the conversations. Those talks broke down when United Technologies' stock price suffered significant declines and the two companies found themselves unable to agree on who would be in control of the combination.”

The two companies are large players in the climate control business and lead the Manufacturer of aerospace and aviation industries. Due to their market shares, it is likely that any combination would be subject to significant antitrust review in the United States as well as in Europe.

ASAP Semiconductor is a leading supplier of Aerospace Industry Parts and has the resources to supply an array of Honeywell and United aircraft products. We provide our customers with a simplified and speedy procurement process for the betterment of their production and effectiveness in their supply course. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com call us toll free at 1-714-705-4780.


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Dornier Seawings Seastar

Dornier Seawings announced at this year’s Singapore Airshow that production will start for the Seastar. After two years of development and upgrades The Seastar is said to be “the world’s most advanced amphibious aircraft”.  The European Aviation Safety Agency is set to award Dornier Seawings an amended Type Certificate in the second quarter of 2018. Dornier Seawings plans to roll out the final product to their customers, later that year.

This was all made possible by Dornier Seawings, Wuxi Industrial Development Group, and Wuxi Communications Industry Group Co. Ltd. coming together to produce the best aircraft of its kind. Assembly will start in Oberpfaffenhofen, Germany and open another assembly facility later in Wuxi, China. The Seastar has allowed Dornier Seawings to partner with various industry supply leaders such as Honeywell International Inc. USA, Diamond Aircraft Industries Inc. Canada, MT Propellers, Germany, SPP Canada Aircraft Inc, and Pratt & Whitney Canada.

This aircraft operates on land and water without a change in performance. It is said that the Seastar can reach up to 180 KTAS, which is the fastest aircraft in its class; the nearest competitor is 40 KTAS slower.  The Seastar is made of an all-composite, corrosion-free airframe which allows for cheaper maintenance costs. With all of the positive customer responses worldwide, Dr. Albert Halder, CEO of Dornier Seawings believes that the Seastar will be a “commercial success”.

The Seastar is also enhanced by the level of safety that it provides. In the event of engine failure, there are two turboprop engines that eliminate any chance of asymmetric thrust.  The sponsons hold the landing gear and fuel tanks which allows for excellent water handling. These features allow for easy mobility through rough air & sea conditions.

With Dornier Seawings commitment of excellent service to customers and operations, they have created the Seawing that provides superior performance, safety, and low maintenance cost.

Scroll and click to your desired parts from the top brand manufacturers, one snap speed quote revert with complete customer care assistance. We provide a simplified and speedy procurement process. We ensure that our customers production lines and prototype builds are always up and running effectively. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com call us toll free at 1-714-705-4780.


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graphene flakes

In recent years, computer chips researchers have been hard at work developing methods by which increase both the speed and efficiency of information processing. Although several methods have since come to light, none show more promise than the addition of graphene flakes. By integrating graphene flakes into existing computer chip designs, researchers believe they can produce a new breed of hyper fast chip known as “neuromorphic” chips that will function similarly to neurons in the human brain. These new chips will communicate via timed laser spikes as opposed to more traditional binary codes. In this manner, neuromorphic chips will enable computers to process multiple information sources all while immensely increasing processor speed and accuracy.

“We’re essentially using time as a way of encoding information,” says Bhavin Shastri, a Banting postdoctoral fellow in electrical engineering at Princeton University. Computation is based on the spatial and temporal positions of the pulses. “This is sort of the fundamental way neurons communicate with other neurons,” he says.

In order for neuromorphic chips to be truly viable, they must be able to operate accurately down to one-trillionth of a second (one picosecond). After trying a number of different material options, researchers found that the only way to achieve such precise timing is to insert a flake of graphene within a transistor laser. The graphene then acts as type of photon sponge by absorbing photons and then quickly releasing them in one short spurt of energy. Additionally, graphene can still function flawlessly at any laser wavelength and any laser color. Graphene infused neuromorphic chips might just be the breakthrough that the chip industry has been searching for, and this technology could be the key to more advanced computing. Look for graphene infused chips to becoming increasingly prevalent over the next decade and beyond.

ASAP Semiconductor is a leading supplier of Aerospace Industry Parts as well as Electronic Semiconductor components. We provide our customers with a simplified and speedy procurement process. We ensure that our customers production lines and prototype builds are always up and running effectively. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com call us toll free at 1-714-705-4780.


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microchip-2

Researchers at the University of Washington have developed a dissolvable electronic sensory chip that melts inside your head.

The purpose of the chip is to detect injuries within the brain or any other organ of your choosing, and transmit the medical data wirelessly. These ones may even work better when it comes to detecting problems early on, therefore preventing bigger issues.

The chips are about the same size as a grain of rice, so they will be able to monitor almost any part of the body. Scientists at the University of Washington successfully tested them on rats, showing no negative signs after the chip melted away. The development has been compared to dissolvable stitches, which were a huge advancement in the medical community. These chips would dissolve in biofluids, to result in biocompatible end products.

The testing process involved putting the tiny grain of sensor chip under the skin on top of the rat’s skull. All of the readings that were transmitted through the wireless chip matched up with what the conventional, hardwired systems said, including temperature and intracranial pressure after traumatic brain injury or brain surgery.

Engineering and materials science professor John Rogers of University of Illinois at Urbana-Champaign was very impressed by the technology, saying it could possibly eliminate the need risky surgical extractions. The most practical thing about it, he thought, was the dissolvability.

“The devices can be adapted to sense fluid flow, motion, pH or thermal characteristics, in formats that are compatible with the body's abdomen and extremities, as well as the deep brain,” he stated.

If these chips are developed to their full potential, they may be able to replace hardwired systems that use cumbersome equipment. The current systems also leave patients prone to infection, bleeding, and allergic reactions.

ASAP Semiconductor is a leading supplier of board level components. Prospective customers can browse our inclusive inventory of hard-to-find obsolete and current parts at https://www.asapsemi.com. If you are interested in a part, please feel free to contact our knowledgeable sales staff at sales@asapsemi.com  or call us at 714-705-4780 for a quote.


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2-2-2016asapsemi

A new silicon chip is about to change the game. Quantum information processing is about to be revolutionized by Yale Tang Lab which announced Thursday that it has taken the first step towards creating a super computer. Hong Tang who is the head of Tang Lab and with the help of his staff has developed a chip that serves the two most important function of a super computer which is the ability to detect photons and control them. The project is four years in the making. The inspiration for the chip comes from the chip technology that are being used by IBM and Samsung with the end game of creating a quantum computer that is scalable which would resolve the age-old restrictions of the physical space that computers and quantum computers take up.

Carsten Schuck speculates that the arrival of this technology has the ability to revolutionize the speed at which computer application can operate. Things like searching a database, cracking codes, running complex simulations across countless models and back testing them simultaneously will happen in the blink of an eye. Tang went so far as to compare using a modern day computer to using an Abacus! Professor Xiaosong Ma of Nanjiang University reveals that the team used advanced nanofabrication techniques to scale down the size of the element to as tiny as a nanometer.

The end goal is to put thousands of elements on a chip so while the speed and size capabilities will increase exponentially, conversely so will the space that the chips and ultimately the quantum computers shrink. Although this is ground-breaking news, all involved are pumping the brakes and cautions us not to celebrate prematurely. Tang Lab researchers and developers expect to further develop this technology that will create future versions of the chip so that one day the dream of a super computer will finally come to fruition.

Obtain quick quote of the genuine and guaranteed electronic components from ASAP Semiconductor. We provide our customers with a simplified and speedy procurement process. We ensure that our customers production lines and prototype builds are always up and running effectively. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com or call us at toll free at 714-705-4780.


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sony semiconductors

Sony recently announced that it will purchase Israeli Chipmaker Altair Semiconductor for the price of $212 million. This deal comes as the Japanese electronics company prepares to increase its focus on electronic chip technology that will be beneficial for developing sensors commonly used in the internet of things. Altair Semiconductor was founded in 2005 by former Texas Instruments executive managers.

The company develops high quality modern chips used to connect devices such as power meters and security alarms to the internet. With the internet of things in mind Sony plans on combining the connective technology found in this chips with sensing technology and image sensors. This will increase the connectivity of devices by making it easier for devices to sense other devices, especially via cellular connection.

 Kazuo Hirai, Sony Chief Executive Officer recently stated that "More and more 'things' are expected to be equipped with cellular chip sets, realizing a connected environment in which 'things' can reliably and securely access network services that leverage the power of cloud computing."

The Japanese electronics company has gradually been moving away from consumer electronics in recent years and has instead focused more on increasing growth in its image sensor development, motion picture development and video games. Advancements into the images sensor market where seen in Sony’s acquisition of Toshiba’s image sensor development department. This move was done to bolster Sony’s image sensor development and as part of the deal Sony acquired Toshiba’s sensor manufacturing facility located in Oita, Japan.

ASAP Semiconductor is a leading supplier of Semiconductor Industry Parts and has the resources to supply an array of Sony products. We provide our customers with a simplified and speedy procurement process. We ensure that our customers production lines and prototype builds are always up and running effectively. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com call us toll free at 1-714-705-4780.


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Energy-Efficient Light Chip

Light chips being developed by researchers could soon lead to more energy-efficient data centers through existing manufacturing technology.

A top team of researchers at MIT, University of California, Berkeley, and the University of Colorado, Boulder have teamed together to create the chip that could end up helping the environment tremendously.

The way it works is by having a microprocessor that uses optical connections instead of electrical wires to shuttle data around. While it may sound simple in theory, the process of actually creating one that works has stumped chip designers for years. The electronic-optical microprocessor will integrate more than 70 million transistors and 850 optical components. The system uses optical fibers, transmitters, and receivers to send data between a processor chip and a memory chip. When tested, it ran a graphics program to display and manipulate a 3-D image, which is an action that would need to utilize the internal optical connections to collect data from memory and follow instructions.

The optical connections can carry more data in a more efficient manner while using the same amount of power as an electrical one. Current models get blown out of the water by the new prototype, which can transfer data at a blinding 300 gigabits per second per square millimeter.

These developments are significant due to the high energy consumption of many data centers. Most of these facilities consume the same amount of electricity as a small town in order to remain operational, resulting in large amounts of carbon emissions spewing into the environment. It is estimated that around a quarter of energy used in data center servers is spent transferring data through the processor, memory, and networking cards. With the new light chips, the carbon footprint of these technological warehouses may be greatly reduced.

ASAP Semiconductor is a leading supplier of transistors and components. Prospective customers can browse our inclusive inventory of hard-to-find obsolete and current parts at https://www.asapsemi.com/manufacturers.aspx. If you are interested in a part, please feel free to contact our knowledgeable sales staff at sales@asapsemi.com or call us toll free at 714-705-4780 for a quote.


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fujitsu

Fujitsu Ltd., a Japanese multinational information technology services and equipment company, operates as the world’s fourth-largest IT services provider measured by revenues. The company has recently announced that they will be spinning off its smartphone and personal computer operations into two distinct, separate wholly-owned subsidiaries by February 1. This decision was approved in a board meeting which took place on December 24, making Fujitsu the most recent tech giant to divide its computer server, technology services, and networking equipment divisions from their other operations which sell relatively low-margin commodity products.

This spinoff trend started around a decade ago in 2005, when IBM sold its PC division to Lenovo. Prior to Fujitsu’s announcement, the most recent spinoff was the Hewlett Packard Enterprise and HP Inc. split which became official on November 1. Fujitsu’s announcement does not appear to be much of a surprise though, as PC shipments are forecasted to fall by more than 10% this year. Fujitsu intends on continuing ownership of the two business entities, but wants the management of the two companies to be entirely responsible for their own business results.

“With the ongoing commoditization of ubiquitous products, mainly of PCs and smart phones, it has become increasingly difficult to achieve differentiation, and competition with emerging global vendors has intensified,” said the Fujitsu board in a statement.

Allegedly in early December, there were several news reports which speculated that Fujitsu was considering a three-way agreement among Toshiba and Vaio, a company which was created by Sony Electronics when they spun out its PC business last year. This potential agreement would have created for Japan’s largest PC manufacturer, though it still would have only ranked seventh in the world in terms of unit shipments.

ASAP Semiconductor has resources available to supply a vast array of Fujitsu products. We provide our customers with a simplified and speedy procurement process. We ensure that our customers production lines and prototype builds are always up and running effectively. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com or call us toll free at 714-705-4780.


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Bombardier C-Series Jet

After being granted an airworthiness certificate, Bombardier has received the final go ahead to start delivering its C Series jet to customers. The C Series is intended to fill a perceived market gap between regional jets and the A320 and 737 commercial jets manufactured by Airbus and Boeing.

This good news for the aerospace company comes after a much anticipated release that initially drew a great amount of attention from customers, but was plagued with delays and an ever increasing budget. The announcement of the availability of this jet series comes over two years late, with the company having a net debt of over $6 billion. The delays in release has made it difficult for airlines to schedule fleet upgrades and created a sense of uncertainty that has led to most of these airlines taking a wait-and-see approach to ordering from the company.

So far Bombardier has been able to get less than 300 orders for the aircraft, but the company is willing to reduce prices for the C- Series in order to increase costumer interest. More to that with Transport Canada certifying the jet series for use, U.S. and European regulators are likely to approve of it as well.

ASAP Semiconductor is a qualified vendor of Aerospace Industry Parts. If you are interested in a Bombardier, Boeing or Airbus Airline products, please feel free to contact our knowledgeable sales staff at sales@asapsemi.com or call 1-714-705-4780 for a quote.


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