A new silicon chip is about to change the game. Quantum information processing is about to be revolutionized by Yale Tang Lab which announced Thursday that it has taken the first step towards creating a super computer. Hong Tang who is the head of Tang Lab and with the help of his staff has developed a chip that serves the two most important function of a super computer which is the ability to detect photons and control them. The project is four years in the making. The inspiration for the chip comes from the chip technology that are being used by IBM and Samsung with the end game of creating a quantum computer that is scalable which would resolve the age-old restrictions of the physical space that computers and quantum computers take up.

Carsten Schuck speculates that the arrival of this technology has the ability to revolutionize the speed at which computer application can operate. Things like searching a database, cracking codes, running complex simulations across countless models and back testing them simultaneously will happen in the blink of an eye. Tang went so far as to compare using a modern day computer to using an Abacus! Professor Xiaosong Ma of Nanjiang University reveals that the team used advanced nanofabrication techniques to scale down the size of the element to as tiny as a nanometer.

The end goal is to put thousands of elements on a chip so while the speed and size capabilities will increase exponentially, conversely so will the space that the chips and ultimately the quantum computers shrink. Although this is ground-breaking news, all involved are pumping the brakes and cautions us not to celebrate prematurely. Tang Lab researchers and developers expect to further develop this technology that will create future versions of the chip so that one day the dream of a super computer will finally come to fruition.

Obtain quick quote of the genuine and guaranteed electronic components from ASAP Semiconductor. We provide our customers with a simplified and speedy procurement process. We ensure that our customers production lines and prototype builds are always up and running effectively. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com or call us at toll free at 714-705-4780.

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sony semiconductors

Sony recently announced that it will purchase Israeli Chipmaker Altair Semiconductor for the price of $212 million. This deal comes as the Japanese electronics company prepares to increase its focus on electronic chip technology that will be beneficial for developing sensors commonly used in the internet of things. Altair Semiconductor was founded in 2005 by former Texas Instruments executive managers.

The company develops high quality modern chips used to connect devices such as power meters and security alarms to the internet. With the internet of things in mind Sony plans on combining the connective technology found in this chips with sensing technology and image sensors. This will increase the connectivity of devices by making it easier for devices to sense other devices, especially via cellular connection.

 Kazuo Hirai, Sony Chief Executive Officer recently stated that "More and more 'things' are expected to be equipped with cellular chip sets, realizing a connected environment in which 'things' can reliably and securely access network services that leverage the power of cloud computing."

The Japanese electronics company has gradually been moving away from consumer electronics in recent years and has instead focused more on increasing growth in its image sensor development, motion picture development and video games. Advancements into the images sensor market where seen in Sony’s acquisition of Toshiba’s image sensor development department. This move was done to bolster Sony’s image sensor development and as part of the deal Sony acquired Toshiba’s sensor manufacturing facility located in Oita, Japan.

ASAP Semiconductor is a leading supplier of Semiconductor Industry Parts and has the resources to supply an array of Sony products. We provide our customers with a simplified and speedy procurement process. We ensure that our customers production lines and prototype builds are always up and running effectively. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com call us toll free at 1-714-705-4780.

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Energy-Efficient Light Chip

Light chips being developed by researchers could soon lead to more energy-efficient data centers through existing manufacturing technology.

A top team of researchers at MIT, University of California, Berkeley, and the University of Colorado, Boulder have teamed together to create the chip that could end up helping the environment tremendously.

The way it works is by having a microprocessor that uses optical connections instead of electrical wires to shuttle data around. While it may sound simple in theory, the process of actually creating one that works has stumped chip designers for years. The electronic-optical microprocessor will integrate more than 70 million transistors and 850 optical components. The system uses optical fibers, transmitters, and receivers to send data between a processor chip and a memory chip. When tested, it ran a graphics program to display and manipulate a 3-D image, which is an action that would need to utilize the internal optical connections to collect data from memory and follow instructions.

The optical connections can carry more data in a more efficient manner while using the same amount of power as an electrical one. Current models get blown out of the water by the new prototype, which can transfer data at a blinding 300 gigabits per second per square millimeter.

These developments are significant due to the high energy consumption of many data centers. Most of these facilities consume the same amount of electricity as a small town in order to remain operational, resulting in large amounts of carbon emissions spewing into the environment. It is estimated that around a quarter of energy used in data center servers is spent transferring data through the processor, memory, and networking cards. With the new light chips, the carbon footprint of these technological warehouses may be greatly reduced.

ASAP Semiconductor is a leading supplier of transistors and components. Prospective customers can browse our inclusive inventory of hard-to-find obsolete and current parts at https://www.asapsemi.com/manufacturers.aspx. If you are interested in a part, please feel free to contact our knowledgeable sales staff at sales@asapsemi.com or call us toll free at 714-705-4780 for a quote.

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Fujitsu Ltd., a Japanese multinational information technology services and equipment company, operates as the world’s fourth-largest IT services provider measured by revenues. The company has recently announced that they will be spinning off its smartphone and personal computer operations into two distinct, separate wholly-owned subsidiaries by February 1. This decision was approved in a board meeting which took place on December 24, making Fujitsu the most recent tech giant to divide its computer server, technology services, and networking equipment divisions from their other operations which sell relatively low-margin commodity products.

This spinoff trend started around a decade ago in 2005, when IBM sold its PC division to Lenovo. Prior to Fujitsu’s announcement, the most recent spinoff was the Hewlett Packard Enterprise and HP Inc. split which became official on November 1. Fujitsu’s announcement does not appear to be much of a surprise though, as PC shipments are forecasted to fall by more than 10% this year. Fujitsu intends on continuing ownership of the two business entities, but wants the management of the two companies to be entirely responsible for their own business results.

“With the ongoing commoditization of ubiquitous products, mainly of PCs and smart phones, it has become increasingly difficult to achieve differentiation, and competition with emerging global vendors has intensified,” said the Fujitsu board in a statement.

Allegedly in early December, there were several news reports which speculated that Fujitsu was considering a three-way agreement among Toshiba and Vaio, a company which was created by Sony Electronics when they spun out its PC business last year. This potential agreement would have created for Japan’s largest PC manufacturer, though it still would have only ranked seventh in the world in terms of unit shipments.

ASAP Semiconductor has resources available to supply a vast array of Fujitsu products. We provide our customers with a simplified and speedy procurement process. We ensure that our customers production lines and prototype builds are always up and running effectively. We offer cost-effective component solutions by improving our customers’ negotiation power. If you are interested in a quote, please contact our friendly sales staff at sales@asapsemi.com or call us toll free at 714-705-4780.

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Bombardier C-Series Jet

After being granted an airworthiness certificate, Bombardier has received the final go ahead to start delivering its C Series jet to customers. The C Series is intended to fill a perceived market gap between regional jets and the A320 and 737 commercial jets manufactured by Airbus and Boeing.

This good news for the aerospace company comes after a much anticipated release that initially drew a great amount of attention from customers, but was plagued with delays and an ever increasing budget. The announcement of the availability of this jet series comes over two years late, with the company having a net debt of over $6 billion. The delays in release has made it difficult for airlines to schedule fleet upgrades and created a sense of uncertainty that has led to most of these airlines taking a wait-and-see approach to ordering from the company.

So far Bombardier has been able to get less than 300 orders for the aircraft, but the company is willing to reduce prices for the C- Series in order to increase costumer interest. More to that with Transport Canada certifying the jet series for use, U.S. and European regulators are likely to approve of it as well.

ASAP Semiconductor is a qualified vendor of Aerospace Industry Parts. If you are interested in a Bombardier, Boeing or Airbus Airline products, please feel free to contact our knowledgeable sales staff at sales@asapsemi.com or call 1-714-705-4780 for a quote.

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Boeing 737 MAX 8

Boeing announced that it has completed final assembly of its first 737 MAX 8 aircraft. The 737 MAX 8 is Boeing’s answer to European competitor Airbus’ A320neo jetliner, the first of which is to be delivered to Qatar Airways before year’s end.

Today marks another in a long series of milestones that our team has achieved on time, per plan, together,

said Keith Leverkuhn, Vice President and General Manager, 737 MAX, Boeing Commercial / Airplanes.

With the rollout of the new 737 MAX - the first new airplane of Boeing’s second century - our team is upholding an incredible legacy while taking the 737 to the next level of performance.

Backed by CFM International LEAP-1B engines, the new single-aisle 737 MAX 8 will consume 20% less fuel than the first batch of next-generation 737 aircraft.

The complexity of this is not so much the changes in the airplane itself, but more about how you weave this new airplane into a factory that’s been producing (the current 737) for 19 years now, said Leverkuhn.

Specifications of the Boeing 737 MAX 8 jetliner are as follows:

  • Max Design Taxi Weight: 181,700 lb / 82,418 kg
  • Max Design Takeoff Weight: 181,200 lb / 82,191 kg
  • Max Design Landing Weight:152,800 lb / 69,309 kg
  • Max Design Zero Fuel Weight: 145,400 lb / 65,952 kg
  • Max Design Fuel Capacity: 6,853 US gallon / 25,941 liter
  • AFT Cargo Compartment Capacity: 883 cu. ft. / 25.00 cu. m
  • FWD Cargo Compartment Capacity: 660 cu. ft. / 18.69 cu. m
  • Total Cargo Capacity: 1,543 cu. ft. / 43.69 cu. m
All the milestones have been met. Engineering has been early. The supply chain is performing well," said Leverkuhn. "When the airplane actually showed up here in the factory, the mechanics were ready to go. The parts teams were ready to go. So this is a celebration for the team."
After completing its first flight scheduled in the beginning of 2016, the 737 MAX 8 is due to enter service with Southwest Airlines in the third quarter of 2017. It will be joined by the 737 MAX 9 in 2018 and the 737 MAX 7 in 2019.

If you have part requirement of Boeing, please feel free to contact our knowledgeable sales staff at sales@asapsemi.com or call 1-714-705-4780 for a quote.

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Coming off an order from South Korea’s largest airline Korean Air, Airbus Group SE announced that it has booked more than 1,000 orders for its family of jetliners in the first 11 months-January to November-of the year 2015. Shares for the Toulouse, France-based group rose as it looks certain that Airbus will win its annual orders race against North American rival Boeing. Though Airbus has booked more orders, Boeing remains the largest jetliner producer as the Chicago, Illinois-headquartered Boeing delivers more aircraft out of its factories.

The Airbus Group’s shares rose 2.8 %, while Boeing’s shares rose 0.4% higher.

After forming a tentative deal at the June 2015 Paris Air Show, Korean Air formally signed for 30 Airbus A321neo jetliners.

The A321 is the largest member of the A320 family of jetliners. The “neo” designates that these aircraft come with a new engine option. Though backed by a pair of latest-generation engines-either the CFM International’s LEAP-1A or the Pratt & Whitney PurePower PW1100G-JM-the A319neo, A320neo, and A321neo share 95% spares commonality with current engine option A320 aircraft. In two-class configuration, the A321 accommodates 185 passengers-16 passengers in business class and 169 passengers in economy class. In high-density configuration for low-cost and charter operators, the A321 seats up to 220 passengers.

In the month of November, Airbus sold 169 aircraft to bring its gross total for the year to 1,079 aircraft. However, after cancellations and model conversions, Airbus’ net figures became 1,007 aircraft. From January to November 2015, Airbus delivered 556 aircraft-including 10 A350 long-range, twin-engine, wide-body jetliners and 24 A380 double-deck, wide-body, four-engine jetliners.

In the same 11-month time period, Boeing nabbed 655 gross orders. After cancellations from customers, the net total became 568 aircraft. Compared to Airbus’ 556 deliveries, Boeing came out ahead with 709 planes delivered to customers.

As of today, Airbus has received more than 4,300 firm orders for the A320neo aircraft.

ASAP Semiconductor is a wholesale distributor of all Airbus parts. Regardless of what Airbus parts you need, contact us today at sales@asapsemi.com and our knowledgeable sales staff will assist you.

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Toshiba Image Sensor

Confirming rumors from October, Sony announced that it has acquired rival Toshiba’s image sensor unit for $155 million. Sony itself has recently reorganized its sensor business unit into a wholly-owned subsidiary dubbed the Sony Semiconductor Corporation. Under the agreement, Toshiba will transfer its Oita Operations semiconductor fabrication facilities, equipment, and related assets.

Under the deal, Sony will own Toshiba’s Oita Operations unit which served as Toshiba’s primary 300mm wafer production line. The doors to the Oita Operations facilities were first opened in February 2004. It has a building area of 24,100 square meters and a total floor space of 48,800 square meters. The main products it produces are CMOS (complementary metal-oxide semiconductor) image sensors and memory controllers.

CMOS (complementary metal-oxide semiconductor) hardware are battery-powered memory chips in a computer that house startup information. A computer’s basic input/output system (BIOS) utilizes the startup data housed by the CMOS hardware whenever the computer starts up.

CMOS sensors serve as an alternative to change-coupled device (CCD) image sensors. Change-coupled devices transfer electrical charge within a device to an area where the charge can be easily manipulated.

An advantage of using a complementary metal-oxide semiconductor sensor versus a change-coupled device sensor is that CMOS sensors tend to be more cost-efficient.

Another advantage of using CMOS image sensors over CCD image sensors is that in the event that a light source has overloaded the sensitivity of the device, the CMOS would not bleed the light source onto other pixels due to its low blooming properties.

The two companies expect to complete the acquisition and transfer of properties and assets by the end of the fiscal year, March, 31, 2016.

The specific address of the Oita wafer fabrication facility is: 3500 Oaza Matsuoka, Oita City, Oita Prefecture, Japan.

ASAP Semiconductor is a wholesale distributor of all Sony and Toshiba parts. Regardless of what Sony parts you need, contact us today at sales@asapsemi.com and our knowledgeable sales staff will assist you.

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Boeing C-17 Globemaster

In an event attended by hundreds of Boeing employees and aviation enthusiasts, the last Boeing C-17 Globemaster cargo aircraft built at the manufacturer’s Long Beach, California, facility completed a flyover of Long Beach Airport before heading to San Antonio, where its new owner, the Qatar government, will pick it up in early 2016. This C-17 Globemaster is notable for being the last civilian or military aircraft to be built in the state of California-at least for now.

In September 2013, Boeing announced that it would close the Long Beach C-17 Globemaster plant-ending seven decades of aircraft production at that facility.

The C-17 Globemaster is manned by a pilot and co-pilot in the cockpit, with room for two observers.

Housed in the C-17 Globemaster’s cockpit, the digital avionics system consists of four Honeywell multi-function cathode-ray tube displays, a duo of head-up displays (HUDs), two Lockheed Martin central processing computers, a single Hamilton Sundstrand data management computer, twin Honeywell air data computers, and cargo systems. The electronic flight control system is redundant four-times-over, ensuring backup systems are in place.

Backed by four Pratt & Whitney PW2040 turbofan engines providing 40,400 pounds of thrust each, the C-17 Globemaster cruises at speed between Mach 0.74 and 0.77. Without refueling, the C-17 Globemaster can carry a payload of 160,000 pounds for a range of 2,400 nautical miles. With refueling, the C-17 Globemaster can fly non-stop intercontinentally.

In May 1995, the C-17 Globemaster team received the famed Collier Trophy-declaring the cargo lifter the top aeronautical achievement of the year.

To date, Boeing has delivered more than 260 C-17 Globemasters to operator’s worldwide-including 223 aircraft to the US Air Force and 37 aircraft to Australia, Canada, Kuwait, India, Qatar, the United Arab Emirates, the United Kingdom and NATO’s 12-member Strategic Airlift Capability alliance. The members of the NATO C-17 alliance include ten NATO nations (Bulgaria, Estonia, Hungary, Lithuania, the Netherlands, Norway, Poland, Romania, Slovenia and the United States) and two Partnership for Peace (PfP) nations (Finland and Sweden).

ASAP Semiconductor is a wholesale distributor of all Boeing parts. Regardless of what Boeing parts you need, contact us today at sales@asapsemi.com and our knowledgeable sales staff will assist you.

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Toshiba Wireless Power Receiver IC

Toshiba America Electronic Components, Inc., announced that is has launched the industry’s first single-chip 15W wireless power receiver IC that is compliant with the Qi v1.2 specifications spelled out by the Wireless Power Consortium. Designated the TC7766WBG, the new chip is optimized for use in mobile devices such as smartphones and tablets.

"The 'holy grail' for wireless charging for high-performance portable devices has been 15W, and we've been steadily working toward this objective with continued additions to our family of wireless charging devices,"

said Deepak Mithani, senior director of the Mixed Signal Business Unit, System LSI Group at Toshiba America Electronic Components, Inc.

"Making a 15W wireless power chip that allows for rapid charging available to our customers in a package with the same footprint as our previous product will help speed the design-in process and help them get advanced charging devices to market more quickly."

Tripling the received power capability of its precursors and competing chips, the new 15W TC7766WBG has all the functions needed to form a standalone wireless power transfer RX system. Derived from 0.13-micron CMOS/DMOS semiconductor process technology, Toshiba’s CD-0.13 process marries small packaging with large capabilities-creating a cost-efficient system that leaves a small footprint.

"This enables wireless power for subsequent charging of smartphones, tablets and handheld devices at speeds comparable to or, in some cases, faster than conventional wired chargers," Toshiba said.

Generating 15W of maximum output power, the TC7766WBG generates a maximum output current of 1.7 amps (A), output voltage range of 5 to 14 volts (V), full protections, and the advanced Qi Foreign Object Detection functions. Contained in a low-Z-height WCSP28 housing, the chip runs 2.4mm x 3.67mm x 0.5mm.

Prototypes of the new TC7766WBG wireless power receiver IC will be delivered at the end of the year, with mass manufacturing slated to start in spring of 2016.

Founded in 1875, Toshiba is Japan’s largest semiconductor maker and the industry’s sixth-largest semiconductor manufacturer.

If you have part requirement of Toshiba, please feel free to contact our knowledgeable sales staff at sales@asapsemi.com or call 1-714-705-4780 for a quote.

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