The company Tasel is an atomic layer deposition specialist. Their other businesses include encapsulating flexible electronics, protecting OLEDs, solar cell surfaces passivation, x-ray machine moisture barriers and anti-tarnish treatment for jewelry, RFID tags and optical components. The Tasel-branded ELT15S technology, which is the fully transparent electroluminescent, has come out.

“Tasel displays combine the rugged and reliable build of thin-film electroluminescence with the unique freedom of designing a completely transparent display,” said the firm. “It is ideal for consumer electronics, architectural use and other fields where viewing experience and product aesthetics is of paramount importance.”

The firm also said, “If you coated a full-size football field with Beneq’s nClear moisture barrier, which is more commonly used for OLED encapsulation, less than a drop of water would infiltrate the whole surface in a day. That makes the coating a billion times better a moisture barrier than the typical alternatives.”

The firm also makes non-see-through matrix displays which response time is said to be under 1 ms regardless of temperature.

“Over the last 30 years, TFEL technology has proven its excellence in applications ranging from monitor and control instruments in deep-sea vessels to operation systems in orbital spacecraft. Besides these extremes, TFEL displays have found their way into countless other applications, where uncompromised reliable and accuracy are required,” said Beneq of Finland; where the transparent display is available.

ASAP Semiconductor distributes all parts for these projects and others related to electroluminescent technology.


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Zytronic signs global deal with Future

Zytronic are global leaders that have been providing touch solutions for over 15 years. They are well known in the industry due to their reliability and efficiency. They have a passion and commitment to this technology and that is what has brought them so much success in the past years. They are experts. They have many technologies that can help them establish the best touch screens. They are committees to developing innovative touch technology that use quality systems. They have one of the best multilingual/multinational sales, customer service and technical support team are one of the best they aid throughout any project. They are the future for the touch interactivity for self-service and public use. They are known for investing around 10% of their annual revenue to the development of new technology and for any product development.  Due to many testing and their efficiency, their products are proven to be the solution and proven to be durable and exceptional especially in tough environments. Their products are able to provide reliable performance 2 hours per day, 7 days per week and 365 days per year.

They recently developed a ruggedized capacitive sensor from its facility in Newcastle. They are being manufactures in a cleanroom conditions and they are planning to increase sensors up to 65 inch diagonal. They collaborated up with Future where together they are planning to design ZyBird p-cap touch sensors. Ian Crosby, sales and marketing director at Zytronic stated

“With this new agreement, those customers who prefer to purchase a fully integrated touch display solution from a supplier with global reach and support have a new option.

With this new partnership and teamwork will be much more strong and reliable product that many customers want.


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SiFive's Newest SoC

SiFive known as RISC-V pioneer has released their newest innovative SoC (system on a chip) to enhance combination of systems. The latest SoC is formed on the similar base of the original RISC-V design but has been modified for greater capacity. The manufacture of the SoC is the Taiwan Semiconductor Manufacturing Company (TSMC) that was built on a 180-nm process. Some of the main applications that the SoC can be incorporated into are microcontrollers, embedded, loT and wearable applications. The FE310 is equipped with the latest SiFive technology such as the E31 CPU Corplex, which holds a 32 bit RV32IMAC core that is able to perform at a 320MHz speed. The SoC is also equipped with

“16kbyte L1 instruction cache, a 16kbyte data SRAM scratchpad, hardware multiply/divide, debug module and an OTP nonvolatile memory. Peripherals include UARTs, QSPI, PWMs and timers”

Post to announcing the Chip SiFive shortly released the FE310 RTL code to the public to allow designers to be able to tamper with it and create their own SoC which would work hand in hand with the base FE310. By making it open to the public it made it apart of the Freedom Everywhere family of customizable SoCs.

Previously stated by the executive director of the nonprofit RISC Foundation, Rick O’Connor,

"We are thrilled to see the first commercial silicon based on RISC-V standards come to market and look forward to continued technology leadership from the SiFive team.”
SiFive is the first "Fabless"  provider of unique semiconductors.  Fabless is a term used to outsource the manufacturing of silicon wafers that are incorporated in most semiconductor production to date. Companies that use fabless structures are able to focus more time on their design of their circuits and possibly reduce labor within the company.

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Drone 3D Printed

Many that thought Drone 3D printing is impossible. For many years this was something that was not considered possible until Philip Keane a PhD student launches a CubeSat company that researches the application of ULTEM 9085 traceable aerospace-grade. High strength FDM 3D printing at Nanyang Technological University in Singapore. He designed what many people thought impossible. He designed a drone that was 3D printed with embedded electronics. Although embedded electronics were not a first and people are familiar with them, what was striking to this invention is the high temperature that was involved in this printing the temperature that is requires is at least 160C. that is only the minimum that is equipped and it goes up to 300C, therefore for him to design a quadcopter that is able to survive these high temperatures was a success and it considered one of the best practices.

The materials that were involved in this are using aerospace grade materials. Philip explained

“One of the toughest challenges was to find electronic components that could theoretically survive the high temperature printing process – we had to add some heat-proofing modifications to the components to ensure they could last. This involved adding new components to the printed circuit boards and designing custom housings.”

Keep in mind the usual temperature surviving rate is usually 80C to 100C therefor moving up to 300C is a great accomplishment and a main reason why many people thought this was not a possible thing. Therefore, when this actually became reality many were shocked and many were excited for this new invention. The most recent and only drone that was completed was completed in under 14 hours and can support over 60kg of work/ this is really impressive and is shocking to many. This would not have been a possibility if it was the products were not available but because there are many parts distributors such as ASAP semiconductor it was a possibility.


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SiC technology into Formula E

Rohm Semiconductor is introducing a new SiC technology that will be in Formula E. SiC stands for silicon carbide which will be in the first face of the Formula E season which is being held in Hong Kong. Rohm Semiconductor, is partnering up with Venturi Formula E team. This will help in the all-electric racing series. Rohm Semiconductors is planning to use the SiC Technology in order to make their power electronics more efficient, smaller, stronger, and faster.

In terms of smaller, the company plans to reduce size and weight which allows for better weight distributions. In terms of stronger, there will be higher voltages to increase power. This will in turn make things faster and efficient.

Here is what Dr. Kazuhide Ino the General Manager of the Power Device Division at Roh, had to see about this.

"We are very excited to see our technology contribute to Formula E racing cars. We are looking forward to proving the quality and efficiency of our products on the circuit. In the coming years, we should see SiC devices increasingly find their way into power electronics for hybrid and all-electric vehicles, creating simpler and more efficient power systems. By making more economical technologies available for a wide array of industries and larger parts of society, we hope to take a prominent role in revolutionizing energy policy."

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Microchip 32-bit PIC for automotive

As technology advances the quality of our lives advances, what we have today in terms of technology and science is considerably amazing compared to what we had a hundred years ago. Not even that long ago, if we look back around two decades and we look at how the automotive industry alone advanced is mind blowing. Twenty years ago we would have never imagined that the technological advances that we have today is even possible. Automotive industry would have not been able to do it alone obviously, technology is advancing from all angles around the globe and it all contributes to one another. Microchips wasn’t even there twenty years ago, now a day’s electronic parts suppliers and microcontroller distributor are all over the place. All over the place is just one aspect as well because even the price of technology has decreased tremendously.

Some scientist predicted that technology is going to advance exponentially, not even linearly but exponentially. This prediction was made around thirty years ago and they were right. Having said that, just a few years ago having smart computers in automotive would have been a little difficult and not even cost effective. This is a perfect time for the automotive industry to start adding more creativity and connectivity in their cars because we have reached a time where the internet is spreading everywhere. The new Microchip’s 32-bit PIC is a step towards that goal and it’s a highly integrated, cost effective processing system that allows data transfer, storage and even internet access with a lot more apps that can support automotive and industrial control applications. This is great because it even provides the operator of the vehicle with a number of solutions before even realizing there is a problem.

At ASAP Semiconductor we deal with electronic components and we are a global supplier and distributor with competitive pricing and the ability to find parts that are hard to find in the market. If you are looking for a part then submit a request online at asapsemi.com with the part number that you are looking for or with the NSN and you will receive a quote shortly. You can also submit a request via email at sales@asapsemi.com or call us at +1-714-705-4780.


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Adafruit-RS-Components

Adafruit is a privately-owned company that is based in the US. Their focus is on designing and manufacturing open source electronic hardware. They are always up to date and are always trying to come with different ways to design their products. It is a competitive field, therefor they always try to design products that are unique and reliable. Because if their competitive products and great service RS has signed a distribution agreement, where Adafruit is supplying hardware, tools, equipment and electronics to makers and hobbyists.

They are planning to get products, a whole line for them products such as boards and accessories for the Raspberry Pi and Arduino. The plan for these products is to be available to RS customers anywhere in the world. Which is cool, it is going to be available worldwide which is helpful. RS product manager Rob Maycroft said

“Adafruit is a well-respected provider of maker and hobbyist products aimed at a highly diverse range of ages and skills. This is important to our growing user base of students and innovators”

and the founder of Adafruit mentioned

“This global agreement with RS will help us extend our reach to ensure that engineers, developers and makers across the world have fast and easy access to our electronics and more.”

This agreement if going to benefit both sides and will even benefit consumers. Getting reliable products is something everyone aspires and every person is looking for it. Adafruit products are unique

“They feature unique and fun DIY electronic components and kits that turn everyday objects into high tech prototypes suitable for education and advanced production concepts”


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Microchip Technology Inc

Microchip Technology Inc. provides microcontrollers and analog semiconductors for different applications worldwide. It became a leading service provider by catering to the needs of a wide variety of consumers. To increase its market even further, Microchip has begun selling an RF transceiver which supports the Sigfox wide area for Internet of Things networks. The stand-alone ATA8520E transceiver is FCC-certified and comes with an AVR micro controller. It also comes with the option of an Xplained PRO development board that is also FCC-certified. What brings users to Sigfox is the lower node power connections that are not available with Bluetooth or Wi-Fi. As of today, there are more than 8 million devices already part of the ISM unlicensed network which operates in 24 countries.

ASAP Semiconductor is a leading parts distribution company that can boast providing reliable technical and customer service support to its increasing customer-base.  Through the hard work put into each purchase order, ASAP has gained the trust of customers who note that compared to other distributors, ASAP truly goes beyond expectations. Parts come with the appropriate certificates, tested accordingly, and every step of the way is tracked to ensure customers are informed if any questions arise throughout any point in the purchasing cycle. Call 714-705-4780 for availability of any part in ASAP’s huge inventory. Or email sales@asapsemi.com for an RFQ.


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800V CoolMOS MosFETs Superjection Technology

Based on the Superjunction technology, Infineon welcomes the latest addition to its family the 800V CoolMOS P7 series of 800V MosFETs. This will be available in twelve R DS(on) classes with six packages to fully address the target application of needs. While Infineon has been focusing on flyback topologies as of late which are found in standard applications like LED lighting, industrial/auxiliary power, audio and adapter, the latest introduction is for low power SMPS applications with products like R DS(on) of 280 mO, 450 mO, 1400 mO and 4500 mO now available for order.

The 800 V CoolMOS P7 series offers a combination of optimized device parameters that will offer up to 0.6% efficiency gain translating into 2 to 8 °C lower MOSFET temperature found in the CoolMOS C3. There is also a 50% in E oss and Q g, as well as a reduced C iss and C oss allowing for higher power density designs, lower switching losses and better DPAK R DS(on) products which will allow customers to reduce BOM costs and provide minimal assembly. An integrated Zener Diode will significantly improve ESD ruggedness but dramatically reduces eSD related production yield loss. Easy to drive and easier to design due to the V (GS)th of 3 V and the smallest V GS(th) variation of only ±0.5 V which will allow for lower driving voltage/ switching losses.


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USB C-Type Drivers

American Technology Company, Texas Instruments has introduced a new protocol-agnostic linear re-driver. A previous model, the SuperSpeed USB supports up to 5Gbit/s video. Compared to that model, this new SuperSpeedPlus has faster capabilities, reaching up to 3.1 data rates that support 10Gbit/s as well as DisplayPort 1.4 up to 8.1Gbit/s intended for downstream.

Texas Instruments has released a few re-drivers which include the TUSB1046-DCI, TUSB1002, and the TPD8S300. Their TUSB1046-DCI will support several other USB Type-C Alt Mode interfaces which will make up for any loss of cable and board trace. The new TUSB1002 will work as a simpler dual channel 10GHz linear re-driver. Lastly, the TPD8S300 is an eight-channel USB intended for voltage protection.

TI is concerned over the release of products and accessories that support their USB Type-C connectors as many do not meet the conditions set for Type-C devices. For example, there are Power Delivery adaptors that do not place at their expected capability on the Vbus line which yields a shortened transmission path of 20V. The connector shorting pins that are in USB Type-C drivers can also move around and slide, which concerns TI as the already short 20V Vbus can be even shortened to CC and SBU pins, especially if any moisture reaches into the device.

Improvements are clearly needed and Texas Instruments is continuing to work on more evaluations of the three chips currently in production and 2 more, the TPD8S300 and TPD6S300, which are still in the design stage.

ASAP Semiconductor distributes electronic components that include USB-Type C drivers by Texas Instruments. Before any part is sold and delivered, it is inspected to ensure part are in serviceable condition. Whether that part is for aviation or other commercial platform, ASAP Semiconductor will try to find exactly what customers require at a price that is affordable. The purchasing cycle begins with contacting one of our representatives at sales@asapsemi.com.


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