Texas Instruments, the American electronics company which makes and designs semiconductors, has recently achieved the fastest 14bit ADC ever, with “one that works at 3Gsample/s, delivering an instantaneous 1.5GHz-per-channel bandwidth, enabling engineers to implement wide-band in-phase and quadrature-component receivers beyond 2.5 GHz,” said the company.

The dual-channel ADC32RF45 can be used for direct RF signal conversion up to 4GHz.

said Texas Instruments.

The first in a new data converter family, it eliminates up to four intermediate-frequency down-conversion stages in multi-band receivers.

For multi-band digital down-conversion, each and every analog to digital converter is capable of being connected to a dual-band DDC, or digital down-converter, with up to three autonomous, 16-bit numerically controlled oscillators, or NCOs, per digital down-converter for phase-coherent frequency hopping. The analog to digital converter is equipped with RMS power detectors and front-end peak with alarms to support external automatic gain control, or AGC, algorithms. Various applications are expected for this analog to digital converter, such as in software-defined radio, radar, test, wireless communication, measurement, radio astronomy, defense, and aerospace.

Noise-spectral density of -155dBFS/Hz, is claimed, as is a signal-to-noise ratio of 58.5dB with 1.8GHz on the input.

said Steve Bush from Electronics Weekly.

Volume production is planned for the third quarter of 2016 10x10mm 72pin QFN packaging. There is an evaluation kit, and the firm suggest its ADC be used alongside the LMH3404 7GHz dual-channel differential amplifier, LMX2592 9.8GHz frequency synthesizer and LMK04828 clock-jitters cleaner. In addition, the 66AK2L06 processor offers an alternative to FPGAs.

added Texas Instruments.

The device was on display at the International Microwave Symposium in San Francisco in May.

Read more »


In a recent visit to Hannover Messe exhibition, US President Barack Obama and German Chancellor Angela Merkel were given a demonstration of Germ  an IoT technology and a taste of Industrie 4.0 by Harting on its stand at the exhibition. The President and Chancellor were shown the Rinspeed “Etos” car which uses a MICA mini industrial computer as the neural interface between Cloud and machine which enables the systems and machines to function as part of the IoT. Etos was created by the group best known for building zero-emission aquatic cars, robot-driven EVs and shape-shifting smartphone controlled carriers.

The next-gen car has a custom bodywork covering the carbon fiber and aluminum structure of the BMW i8 and features a fully autonomous mode and eight HD exterior cameras that constantly track people and objects around it. The ETos comes with its own personalized drone which can peel off from the vehicle to complete tasks such as picking up a bouquet of flowers and dropping it off to your loved ones or taking epic selfies while the car drives you around. Industrie 4.0 is a current trend of automation and data exchange in manufacturing technologies which include cyber-physical systems, IoT and cloud computing.

The term was originally coined by the German government to promote the computerization of manufacturing. It is the fourth iteration of the industrial revolution with the first mobilizing the mechanization of production using steam power, the second through electric power and the third being the digital revolution using electronics and IT. There are four major design principles in Industrie 4.0 which are Interoperability, Information Transparency, Technical Assistance, and Decentralized Decisions.

The major characteristics of Industrie 4.0 revolves around the strong customization of products under the conditions of highly flexible mass production. Some large scale projects currently taking place in Industry 4.0 are the BMBF leading-edge cluster “Intelligent Technical Systems OstWestfalenLippe”, BMBF project RES-COM and Cluster of Excellence "Integrative Production Technology for High-Wage Countries". Big Data Analytics play a huge role in helping predict the possibility to increase productivity, quality and flexibility within the manufacturing industry which allows us to assess the advantages among the competition.

Read more »


While driving at night with your headlights off is a serious offense that could have catastrophic consequences, what if the person driving wasn’t you? What if it’s not a person at all? Ford Motor company have been testing autonomous vehicles getting their bearings during the night without any lights. If that sounds like science fiction to you that’s because at one point it was unfathomable that cars could even be autonomous but with the advent of technology and the massive funding and interest pouring in from the public for the ultimate convenience, cars that can drive themselves and passengers, are starting to become a reality.

The test vehicles were fitted with LIDAR sensors instead of headlights and cameras and Ford put it to the test on Ford’s Proving Ground in Arizona. As part of the carmaker’s Ford’s Smart Mobility program, the R&D department was implemented by Ford to drive all future-prone technology development projects ranging from digitization of mobility, connectivity and of course autonomous driving.

Ford believes that night rides will mark the next step towards developing completely autonomous vehicles. If Ford can prove that a car can rely entirely on LIDAR technology eliminating the need for cameras and visible light than the first major milestone will be accomplished. The LIDAR sensors can scan surroundings up to 2.8 million times a second and in connection with a high-resolution digital 3D road-map and the virtual driver software, the vehicle was able to follow twisting roads in a safe and precise manner utilizing LIDAR.

The data is then stored and compared to previous digital high-resolution comprehensive data to describe and navigate the road, geography, topography, and even traffic, trees and lights. LIDAR technology is quite expensive so it wasn’t until recently that developments in LIDAR technology has significantly become more cost-effective and widely available as a result. In co-operation with the RWTH technical university of Aachen (Germany), Ford is at the forefront of autonomous vehicles in Europe and is developing innovative HMI concepts that will be an indispensable part of the evolution from driver assistance system to one hundred percent fully autonomous vehicles.

Read more »


On May 6th 2016, Richard Wilson released an article on Electronics Weekly talking about how Intel i3 processors will be scaling for embedded modules that are COM. Intel has created and designed the XMC module that will come with an envelope that is conduction cooled. This Conduction cooled envelope is appropriate for carriers that are considered either open standard or custom. This includes carriers such as VPX and VME.

Concurrent Technologies are made the latest and greatest COM processor module which is based off the Intel Core processor. This Intel Core processor is the Skylake-H which is considered a 6th generation processor.

The XP B5X/MSD will have a 64GB solid state disk. The solid state disk will provide storage for the operating system.

Here is what Glen Fawcett, the Concurrent Technologies CEO wrote about this topic.

Most of our products are based around the premise that the Intel processor board is the center of a solution that scales by adding more boards in a rack or slot type of environment.

This XP B5x/msd module turns that concept around, allowing customers with a signal processing board to add an Intel processor module for control, storage and display purposes. This makes it simple to create solutions for applications like image analysis and signals intelligence.

Concurrent Technologies works in many fields. Some of these fields include: energy and environment, secure information technology solutions, education and training, logistics information systems, advanced intelligence solutions, and advanced engineering and manufacturing.

Concurrent Technologies has won the award for World’s Most Ethical Company four times by Ethisphere Institute. The headquarters are located in United Kingdom.

Read more »


Mercury Systems has just announced that the company received a $4.7 million dollar contract from the U.S. Government facility for their advanced digital transceivers to be used in an electronic warfare application capacity. Mercury Systems is expected to deliver the order which was booked during the company’s fiscal 2016 fourth quarter over the next several quarters spanning the next couple of years.

Charlie Hudnall, Vice-President and General Manager of Mercury’s Embedded Sensor Products group revealed that the reason the U.S. Government selected Mercury had to do with their ability to rapidly deliver high-performance transceivers for their critical EW defense program at an extremely cost-effective price. Hudnall beamed as he went further to remark that Mercury Systems is proud to be able to offer advanced digital products that will enhance the capabilities of their customer’s systems while marrying that with our own military’s ability to maintain strategic dominance in the electromagnetic spectrum.

Mercury Systems is one of the industry’s forefront leaders as a commercial provider of secure processing subsystems which are optimized for their customer’s needs and mission requirements while being wholly designed and made in the USA. Per Mercury Systems’ website, the company aims to leverage its experience in the radar and Electronic Warfare (EW) domain to offer solutions that addresses current and future war-fighter requirements while addressing the modern day challenges of vulnerability and systemic attacks across the whole RF spectrum.

They have maintained their positional dominance as the industry leader in coherent, fast-tuning, low-latency DRFM-based sub-systems and promises to deliver complex and highly-integrated system-level solutions at an affordable price and in the most expeditious manner. Electronic warfare (EW) refers to any action involving the use of electromagnetic spectrum or any kind of directed energy to control the spectrum, used in an attack against opposition or impede enemy assault via the spectrum.

EW is used to deny the enemy access and subsequently the advantage of the EM spectrum and by ensuring friendly access to the EM spectrum unimpeded. Being that EW can be applied from land, sea, air and space by manned and unmanned systems, it can target anything from humans, technology and weapons.

Read more »


Xerox Corporation, the American global corporation which offers business services as well as document technology products, has recently made the decision to improve techniques for production of smart devices through the use of 3D printing.  The Xerox Corporation is currently working on developing the necessary electronics in order to utilize 3D printing processes to create smart devices. According to the lead of the Novel and Printed Electronics program at the Xerox Corporation’s Palo Alto Research Center (PARC), Janos Veres, the company is diligently working to create electronics 3D printing technologies which will enable for the creation of smart devices of any size or shape.

Most electronics devices that you have today, they are electronics that we build on a board which is rigid. Once we made that board we put it in a box. Every single electronics piece looks like that.

Veres said.

We should be able to make electronics to the shape we dream of.

The company believes that 3D printing will allow for their designers to produce new configurations of electronics with complicated shapes. This room for creativity means that the common design of electronics will no longer constrain placement of sensors. The goal of the Xerox Corporation is to create a 3D printing process which will allow for the production of any device, regardless of complexity, to be equipped with batteries as well as sensors. Such devices may include smart phones, computers, wearable devices, and components in aerospace and automotive industries.

There is an incredible opportunity for printing and it truly opens an entirely new field, and make production on demand and local instead of being the privilege of large factories. That’s the power of printing.

added Veres.

According to Wikipedia,

Xerox is the world’s leading enterprise for business process and document management. Examples of some of the company’s services include: Transaction Processing Services - Xerox manages and streamlines day-to-day processes such as insurance claims, debit card swipes, benefits distribution and payroll. Managed Print Services and Centralized Print Services - Xerox reduces costs and optimize clients’ print and digital document infrastructure.

Read more »


Intel Corporation, one of the globe’s highest valued and largest semiconductor chip maker headquartered in Santa Clara, California, has recently announced that they will be exiting the tablet mobile as well as smartphone SoC business as the company has decided to end its struggling Atom chip product family. The Intel Corporation made this announcement in early April as the company continues to progress with a significant restricting plan. Some of the discontinued products include the Cherry Trail, the Broxton, as well as the SoFIA.

The chip maker’s focus has begun to shift towards “Cloud, IoT, memory/programmable solutions, 5G and Moore’s Law,” suggested Brain Krzanich, the CEO of Intel Corporation, in his most recent blog. The resources that were previously focused on SoFIA/Broxton will now be transferred onto “products that deliver higher returns and advance our strategy,” according to a spokeswoman at Intel Corporation. The spokeswoman confirmed that effective immediately, the SoFIA 3GX, LTE, as well as LTE2 commercial platforms are cancelled. She also verified that effective immediately, the Broxton platform for tablets and phones has also been cancelled.

Intel Corporation’s plans to divert away from the mobile SOC battle seems to make sense, considering that there has been a gradual decrease in demand for both tablets and smartphones. Although, Intel Corporation is not giving up on its connectivity business. Many analysts have agreed that it makes sense for the Intel Corporation to shift its focus onto its 5G and modern technology efforts.

Only 18 months ago, Intel was trying to use alliances with Spreadtrum Communications and Rockchip to make deeper inroads in China where the smartphone market was then growing by leaps and bounds.

stated Junko Yoshida from EE Times.

With Spreadtrum, Intel made a $1.5 billion investment in Tsinghua Unigroup, resulting in the acquisition of 20 percent of China’s combined Spreadtrum Communications and RDA Microelectronics. At that time, Intel appeared to be using Spreadtrum to pry open the Chinese market, asking Spreadtrum to market Intel’s SoFIA SoCs in addition to Spreadtrum’s own chips.

Read more »


Imagine multiple stacks of active layers of transistors without through-silicon bias. Years ago this was an impossible sight, but today two of the largest industry leaders, CEA-Leti & Qualcomm have collaborated in developing the newest 3D chip of its kind.

CEA-Leti is a French research-and-technology organization that focuses on creating value and innovation through technology transfers and specializing in nanotechnologies.  They have been actively working on new 3d Technology in recent years.

Qualcomm is an American semiconductor company that designs and markets wireless telecommunications.  The company headquarters is located in San Diego, California and has 224 locations around the world. Qualcomm was founded in 1985 with its first service provided satellite locating and messaging.

These two giant industry leaders were able to develop technology that allows stacking process of transistors. Leti experts state that this technology does not lower the performance of transistors or between the layers of stacked transistors. CEO, Marie Semeria believes with the collaboration of Qualcomm to their “CoolCube” that the industry is headed in the right direction.

Semeria states that,
Together, we aim to build a complete ecosystem with foundries, equipment suppliers, and EDA and design houses to assemble all the pieces of the puzzle and move the technology into product-qualification phase.

This partnership between Qualcomm and Leti is not new. They have been working together for the past 2 years developing and advancing the true potential of nanotechnology, and 3d chip designing.  Many are optimistic that this technology will be able to answer the many issues in regards to scaling.

Read more »


A group of US and Israeli scientists were brought together to help develop with the world’s tiniest diode. The diode is formed from the size of a single molecule of DNA that is unseen by a conventional microscope.

Diodes are a specialized electronic component that allows the flow of current in one direction. This is discovery allows for a better insight into electronic transport mechanisms. Yoni Dubi, developer from Ben-Grunion University of the Negev states that this breakthrough discovery is “a significant milestone in the development of molecular electronic devices”.

Students from the University of Georgia and Ben-Grunion University of the Negev are coming together to establish similar properties of molecular components and electronic elements to help aid the growth of nano-scale electronics. Dbui and his students were able to construct a theoretical model of DNA, getting a better understanding on how this diode works.

The University of Georgia’s REU program allows for research of micro-/nano-technology, which is funded by the National Science Foundation. The Ben-Grunion University of Negev is a public research university that was established in 1969 and named after Israel’s founder and first prime minister.

The process of developing the tiny diode began by constructing a single DNA molecule from 11 pairs, and connecting an electronic circuit. At first, the DNA molecule was not functioning as a diode, but after inserting another molecule the circuit was immediately altered. Students found that when inserting a molecule between the layers of DNA the current was 15 times stronger.

Read more »

Intelligent PCB

Printed Circuit Boards are primarily designed to mechanically support and connect electronic components electrically thus making them a fundamental part of almost all electronic systems. PCBs are also crucial for thermal management by acting as a heat sink. This allows transfer of heat away from the high-powered components that are likely to overheat as a result of overworking.

As the needs of users grow exponentially each year, manufacturers  and design engineers are looking for increasingly complex ways to squeeze greater capabilities from smaller devices to dissipate heat and reduce the risk of overheating in their products. The design of the PCB is paramount to effective and efficient thermal management of the devices. Thermal simulation is a process widely used in the industry to predict temperature and airflow of a device which in turn is utilized to improve the thermal design of a device.

The simulation results allow engineers to identify issues early on with the thermal design of a device and assists engineers to optimize their designs with the ultimate goal of reducing costs and minimizing overheating. Even the simplest boards require to some degree thermal simulation to ensure that the PCB can withstand the amount of heat and airflow that it is subjected to.

Simulation software back in the 1990’s could only represent PCBs as simple thin blocks and the simulation could only dump the heat into the first adjacent air cell thus providing an inaccurate portrayal of heat transfer from the surface of the PCB. With today’s technology it is possible to model PCBs and components as thick as solid blocks, properly accounting for their layered structures and today’s modern modeling systems boasts a combination of high speed computing and processing power. This has enabled the simulation to represent each individual layer in a PCB design and even include details of layout traces as well as vias and on-board copper content.

An additional advantage of modeling solutions is to analyze how power is best utilized. The copper content of a layer can be analyzed to figure out the best balance between granularity and processing time. The data collected can provide a much less resource-intensive thermal simulation at the cost of a slightly less accurate reading. In the end the thermal management process is the most important as the early stages can provide designers the opportunity to catch issues at the onset and allows them to improve the efficiency and effectiveness of their devices. This will go a long way towards saving energy and costs to areas they might have overlooked.

Read more »

Recent Twitter Posts